Cooling/Ventilation/Heating Modifications TRIZ Cases

Using support struts as electrical conductors replaces wirebonds in cryogenic IR cameras, cutting heat load and cryocooler size.

Lateral airflow redirection between sequential server processors reduces thermal shadowing and improves downstream cooling without raising fan power.

Parallel free-cooling paths and series refrigeration stages let modular chillers meet varying cooling demand with lower energy use.

Combining airflow fins with a liquid circulation path improves heat removal from multiple electronic heat sources in one cooling structure.

Parallel flow channels and diversion structures balance coolant flow across elongated device arrays, reducing temperature differences and impedance.

Adjustable door louvers combine sound absorption, reflection, and EMC shielding to improve data center cooling while protecting equipment.

A diversion structure and manifold chambers balance coolant across parallel channels, cutting temperature differences and flow impedance in elongated electronics.

Separate cold-plate and immersion loops cool high- and low-power server components more efficiently while reducing datacenter power use.

Fresh-air failover cooling uses inlet, exhaust, and return valves to protect IT devices when chilled water cooling fails.

By moving cooling hardware to the cabinet side, this case frees server space, improves heat removal, and simplifies maintenance.

Dynamic fan speed reduction and module switching cut outdoor cabinet cooling energy use while maintaining equipment compartment temperature.

A rotatable block and stop assembly redirects and disturbs coolant flow in tight electronic spaces to improve heat dissipation and secure mounting.

Partitioned dielectric coolant flow enables direct immersion cooling of power supplies, improving heat removal without cold plates or short-circuit risk.

A flexible gas chamber inside the cooling plate absorbs frozen coolant expansion, preventing transport damage without extra piping.

Dynamic fluid routing across modular hot aisle cooling units improves closed data hall cooling under changing server heat loads.

Closed-loop microchannels and a micromixer improve coolant flow and heat exchange for IC dies facing high heat flux and hot spots.

Standardized radiator units with channel portions and expansion joints enable fast server cooling module assembly with lower cost and stable heat dissipation.

Thermoelectric modules turn data center chiller waste heat into electrical power while preserving cooling and reducing energy loss.

Thermoelectric modules on a data center chiller cabinet turn waste heat air into electrical power, improving cooling energy use and reducing heat exhaust.

Integrated refrigerated walls and heat-transfer potting create a direct thermal path from semiconductors and magnetic components to remove heat without added cooling complexity.

Separate coolant zones and mixing barriers let one cold plate tailor temperatures for closely spaced high-power electronic components.

A lever-plunger thermal module cools or heats pluggable optics in outdoor enclosures while protecting the TIM interface during insertion and removal.

A plenum-weir tank layout and redundant dual circulation loops improve dielectric flow uniformity, cooling scalability, and fail-soft operation.

Air bubbles released from an integrated cable conduit reveal cable locations in immersion fluid despite reflection and refraction.

Distributed sensors and load-impact data target climate units at data-center hotspots, reducing unnecessary cooling and energy use.

Partitions and dielectric coolant enable direct immersion cooling of power supplies, improving heat dissipation without cold plates or short-circuit risk.

An axial fan separated from the heat exchanger converts dynamic pressure to static pressure, reducing pressure drops and electrical consumption.

Dielectric fluid circulation cools submerged networking components, reducing air-cooling energy, enclosure volume, and maintenance demands.

Mixed pin- and plate-shaped fins manage airflow changes in an imaging apparatus, preserving heat dissipation around a flow diverter.

A cooling-liquid cavity uses evaporation and condensation to reduce heat resistance and improve temperature uniformity in a remote radio unit.

Shared fans switch between cooling and exhaust roles in a hybrid air/liquid unit, controlling internal temperature without a dedicated exhaust fan.

An elastic pressing structure keeps the transistor, thermal conductor, and cooling plate in close contact, limiting gaps and thermal resistance.

Internal pumps boost dielectric coolant flow to heat sinks, overcoming immersion-cooling impedance for high-power components.

Rigid cooling containers require device-specific designs; flexible membranes, conduits, and dielectric coolant adapt thermal management to varied electronics.

An oblique duct plate and cooling fan force air across heat-generating boards, improving heat discharge while limiting body-size growth.

When a condenser fails, vapor and liquid buffer tanks vent excess vapor and replenish working fluid to prevent overheating in the immersion chamber.