Immersion-Cooled Power Supply Chassis With Partitioned Coolant Flow
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Solution Overview
Problem
Conventional liquid-cooled architectures require active cold plates or copper heat sinks, which occupy cabinet space and use conductive coolants that pose leakage and short-circuit hazards.
Innovation Solution
A liquid-cooled power supply chassis and cabinet design that uses a non-conductive coolant, such as synthetic oil or fluoride, and partitions to facilitate direct immersion cooling without active cold plates, enhancing heat dissipation efficiency by optimizing coolant flow paths and incorporating bypass flows.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cold plates or copper heat sinks are installed in the cabinet for liquid cooling, then heat dissipation capability is improved, but cabinet space utilization deteriorates
Solution Approach 1:
The patent merges the cooling function directly into the power supply chassis by integrating coolant channels within the chassis structure itself, eliminating the need for separate cold plates and heat sinks. This integration combines the cooling system with the power supply housing, achieving heat dissipation without occupying additional cabinet space.
Solution Approach 2:
The coolant channels are nested within the power supply chassis structure, with cooling passages integrated into the chassis walls and internal components. This nesting approach allows the cooling system to be contained within the existing power supply volume, avoiding external space occupation.
2Temperature
If water is used as coolant for liquid cooling, then heat dissipation efficiency is improved, but safety and reliability deteriorate due to leakage and short-circuit hazards
Solution Approach 1:
The patent changes the physical and chemical parameters of the coolant by switching from water to dielectric fluids with different electrical properties. The use of dielectric coolants fundamentally alters the electrical conductivity parameter, eliminating short-circuit risks while maintaining heat dissipation capability through controlled thermal conduction.
Solution Approach 2:
The system employs composite cooling architecture combining dielectric fluid coolant with specialized sealing materials and insulation layers. The coolant system integrates multiple material layers including barrier coatings, sealing elements, and insulating structures that work together to prevent both leakage and electrical conduction.
3Temperature
If conventional liquid cooling architecture is used with separate cooling panels, then heat dissipation is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple cooling components including coolant channels, heat exchange surfaces, and flow control elements into a single integrated power supply chassis structure. This merging eliminates the need for separate cooling panels, pumps, and manifolds, reducing system complexity while maintaining heat dissipation functionality.
Solution Approach 2:
The power supply chassis serves multiple functions simultaneously: structural support, electrical isolation, and liquid cooling. The chassis acts as both the housing and the cooling system, with integrated channels and surfaces that perform both mechanical and thermal management functions, reducing the number of separate components needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation efficiency while eliminating the risk of short circuits and maximizing space utilization by using non-conductive coolants and optimized coolant flow configurations.
Implementation Method 1
the coolant carries the heat away from the cabinet
Implementation Method 2
heat is transferred to a coolant
Data Source
AI summary
A liquid-cooled power supply chassis and a liquid-cooled power supply cabinet and a data center cooling system using the same are provided. The liquid-cooled power supply chassis includes a chassis, at least one power supply, and at least one partition. The chassis has a coolant input terminal and a coolant output terminal. The power supply is installed in the chassis. The partition is disposed in the chassis, and the partition separates the coolant input terminal from the coolant output terminal.


