Immersion-Cooled Power Supply Chassis With Partitioned Coolant Flow

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Solution Overview

Problem

Conventional liquid-cooled architectures require active cold plates or copper heat sinks, which occupy cabinet space and use conductive coolants that pose leakage and short-circuit hazards.

Innovation Solution

A liquid-cooled power supply chassis and cabinet design that uses a non-conductive coolant, such as synthetic oil or fluoride, and partitions to facilitate direct immersion cooling without active cold plates, enhancing heat dissipation efficiency by optimizing coolant flow paths and incorporating bypass flows.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If active cold plates or copper heat sinks are installed in the cabinet for liquid cooling, then heat dissipation capability is improved, but cabinet space utilization deteriorates

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidcabinet space utilization
Core Design Contradiction:
TemperatureVSVolume of stationary object

Solution Approach 1:

The patent merges the cooling function directly into the power supply chassis by integrating coolant channels within the chassis structure itself, eliminating the need for separate cold plates and heat sinks. This integration combines the cooling system with the power supply housing, achieving heat dissipation without occupying additional cabinet space.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The coolant channels are nested within the power supply chassis structure, with cooling passages integrated into the chassis walls and internal components. This nesting approach allows the cooling system to be contained within the existing power supply volume, avoiding external space occupation.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Temperature

If water is used as coolant for liquid cooling, then heat dissipation efficiency is improved, but safety and reliability deteriorate due to leakage and short-circuit hazards

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidsafety against leakage and short-circuit
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent changes the physical and chemical parameters of the coolant by switching from water to dielectric fluids with different electrical properties. The use of dielectric coolants fundamentally alters the electrical conductivity parameter, eliminating short-circuit risks while maintaining heat dissipation capability through controlled thermal conduction.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The system employs composite cooling architecture combining dielectric fluid coolant with specialized sealing materials and insulation layers. The coolant system integrates multiple material layers including barrier coatings, sealing elements, and insulating structures that work together to prevent both leakage and electrical conduction.

Inventive Principle:
Principle #40Composite materials

3Temperature

If conventional liquid cooling architecture is used with separate cooling panels, then heat dissipation is achieved, but device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidcooling system structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines multiple cooling components including coolant channels, heat exchange surfaces, and flow control elements into a single integrated power supply chassis structure. This merging eliminates the need for separate cooling panels, pumps, and manifolds, reducing system complexity while maintaining heat dissipation functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The power supply chassis serves multiple functions simultaneously: structural support, electrical isolation, and liquid cooling. The chassis acts as both the housing and the cooling system, with integrated channels and surfaces that perform both mechanical and thermal management functions, reducing the number of separate components needed.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves heat dissipation efficiency while eliminating the risk of short circuits and maximizing space utilization by using non-conductive coolants and optimized coolant flow configurations.

Implementation Method 1

the coolant carries the heat away from the cabinet

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

heat is transferred to a coolant

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20250344345A1Liquid-cooled power supply chassis and liquid-cooled power supply cabinet and data center cooling system using the same
Publication Date: 2025.11.06 LITE ON TECH CORP
  • US20250344345A1 patent drawing
  • US20250344345A1 patent drawing
  • US20250344345A1 patent drawing

AI summary

A liquid-cooled power supply chassis and a liquid-cooled power supply cabinet and a data center cooling system using the same are provided. The liquid-cooled power supply chassis includes a chassis, at least one power supply, and at least one partition. The chassis has a coolant input terminal and a coolant output terminal. The power supply is installed in the chassis. The partition is disposed in the chassis, and the partition separates the coolant input terminal from the coolant output terminal.