Partitioned Liquid-Cooled Power Supply Chassis for Dielectric Immersion
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Solution Overview
Problem
Conventional liquid-cooled architectures require active cold plates or copper heat sinks, which occupy cabinet space and use conductive coolants like water, posing risks of leakage and short-circuits.
Innovation Solution
A liquid-cooled power supply chassis and cabinet design that uses a non-conductive coolant, such as synthetic oil or fluoride, and partitions to facilitate direct immersion cooling without active cold plates, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cold plates or copper heat sinks are installed in the cabinet for liquid cooling, then heat dissipation capability is improved, but cabinet space utilization is reduced
Solution Approach 1:
The patent merges the cooling function with the existing cabinet structure by making the cabinet walls themselves the heat dissipation surfaces. The inner walls of the cabinet are designed as heat dissipation surfaces that directly contact the power supply devices, eliminating the need for separate cold plates or heat sinks. This integration maintains full cabinet space utilization while providing effective liquid cooling.
2Temperature
If water is used as coolant for liquid cooling, then heat transfer efficiency is improved, but risk of leakage and short-circuit hazards increases
Solution Approach 1:
The patent changes the fundamental parameter of the coolant from conductive (water) to non-conductive (dielectric fluid). This substitution maintains the heat transfer efficiency needed for cooling while completely eliminating the risk of electrical short-circuits and leakage hazards. The dielectric fluid properties are specifically selected to match the thermal requirements while providing electrical isolation.
3Temperature
If partition is added to separate coolant flow paths in the chassis, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent segments the chassis interior into multiple independent cooling zones using partitions. Each zone can have separate coolant flow paths, allowing independent temperature control and optimized cooling for different components. The partitions create distinct regions that prevent thermal interference while maintaining relatively simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation efficiency while minimizing space usage and eliminating the risk of short-circuits by using non-conductive coolants and partitioned flow paths within the chassis.
Implementation Method 1
heat is transferred to a coolant, and then the coolant carries the heat away from the cabinet
Implementation Method 2
the coolant carries the heat away from the cabinet
Implementation Method 3
The partition is disposed in the chassis, and the partition separates the coolant input terminal from the coolant output terminal
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3C
AI summary
A liquid-cooled power supply chassis and a liquid-cooled power supply cabinet and a data center cooling system using the same are provided. The liquid-cooled power supply chassis includes a chassis, at least one power supply, and at least one partition. The chassis has a coolant input terminal and a coolant output terminal. The power supply is installed in the chassis. The partition is disposed in the chassis, and the partition separates the coolant input terminal from the coolant output terminal.