Liquid Cooling Module With Parallel Channels for Uniform Heat Dissipation
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Solution Overview
Problem
Existing liquid cooling systems for elongated arrays of electronic devices suffer from temperature differences and increased flow impedance, leading to reduced reliability and efficiency in heat dissipation.
Innovation Solution
A liquid cooling module with parallel flow channels and a diversion structure that evenly distributes cooling fluid through manifold chambers perpendicular to the elongated direction, using through holes and diversion structures to ensure uniform heat dissipation across multiple devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a series-connected cooling channel is used, then the design is simple, but the temperature difference of fins increases and downstream power modules become less reliable
Solution Approach 1:
The cooling channel is segmented into multiple parallel channels instead of a single series channel. Each parallel channel is equipped with independent flow control structures, dividing the cooling flow into multiple paths that simultaneously cool different sections of power modules, thereby reducing temperature differences and improving reliability while maintaining design feasibility
Solution Approach 2:
Different sections of the cooling system are given different flow rates and cooling capacities according to the local heat generation characteristics of power modules. The flow control structures adjust cooling flow distribution to match the thermal load distribution, ensuring optimal cooling performance for each local region
2Temperature
If continuous fins are used, then heat dissipation coverage is improved, but the system working fluid impedance greatly increases and flow rate decreases
Solution Approach 1:
The continuous fin structure is segmented into multiple discrete fin sections corresponding to different parallel cooling channels. This segmentation allows cooling fluid to flow through multiple separate paths simultaneously, reducing flow impedance in each individual channel while maintaining comprehensive heat dissipation coverage across all power modules
Solution Approach 2:
The cooling system transitions from a single-dimension series flow path to a multi-dimension parallel flow architecture. By adding the dimension of parallel channels, the system achieves both extensive heat dissipation coverage and reduced flow impedance through distributed flow paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces temperature differences and flow impedance, improving overall heat dissipation efficiency by ensuring uniform heat transfer across the devices.
Implementation Method 1
the cooling fluid continuously flows through a plurality of fins for heat dissipation
Implementation Method 2
heat dissipation fins thermally coupled with a plurality of electronic devices
Data Source
AI summary
A liquid cooling module and a heat dissipation assembly using the same are disclosed. The liquid cooling module includes a housing base with an inflow chamber, an outflow chamber, manifold chambers, a partition wall, first through holes, second through holes and a diversion structure. The inflow chamber and the outflow chamber are disposed on a first surface, and divided by the partition wall. The manifold chambers are disposed on a second surface. The first through holes and the second through holes are disposed adjacent to two opposite elongated sides, and arranged along a first direction. The manifold chambers are in communication with the inflow chamber through the first through holes, and in communication with the outflow chamber through to the second through holes. The diversion structure protruding toward the inflow chamber or the outflow chamber provides a diversion function to achieve a uniform flow rate of the parallel flow channels.