Internal Pumping for Immersion-Cooled Electronic Heat Sinks
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Solution Overview
Problem
Existing immersion cooling systems face challenges in achieving adequate dielectric coolant flow rate to electronic components due to high flow impedance, particularly for high power density ICs, which complicates effective heat dissipation.
Innovation Solution
Incorporating an internal pump or fan within the electronic device to direct dielectric coolant towards the heat sink through connecting tubes, enhancing forced convection and overcoming flow impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If immersion cooling is used to cool electronic devices, then heat dissipation capability is improved, but flow impedance increases making it difficult to achieve adequate coolant flow rate to electronic components
Solution Approach 1:
The system divides the cooling function into two parts: a main pump for general coolant circulation and internal pumps within individual electronic devices for localized coolant delivery. This segmentation allows each pump to be optimized for its specific function, with internal pumps overcoming the flow impedance problem at the component level while the main pump handles overall circulation.
Solution Approach 2:
Internal pumps act as intermediaries between the main pump and the heat sinks, receiving coolant from the main pump and delivering it directly to electronic components. This intermediary mechanism solves the flow impedance problem by providing localized pressure boost exactly where needed, ensuring adequate coolant flow rate to high power density ICs.
2Quantity of substance
If internal pumps are added to direct coolant flow, then coolant flow rate to heat sinks is improved, but device complexity increases
Solution Approach 1:
Each electronic device includes its own internal pump that autonomously directs coolant to its associated heat sink without requiring external control. This self-service approach simplifies the overall system control architecture while ensuring each component receives adequate coolant flow, as each device manages its own cooling independently.
3Productivity
If coolant flow is directed toward heat sinks, then heat dissipation efficiency is improved, but additional components are required
Solution Approach 1:
The internal pump, connecting tube, and heat sink are merged into an integrated cooling assembly within each electronic device. This combination delivers coolant directly from the pump through the connecting tube to the heat sink in a unified system, improving heat dissipation efficiency while minimizing the number of separate components compared to external cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation by ensuring consistent coolant flow to heat sinks, maintaining lower operating temperatures and supporting higher thermal design power for high power density electronic components.
Implementation Method 1
Incorporating an internal pump or fan within the electronic device to direct dielectric coolant towards the heat sink through connecting tubes, enhancing forced convection
Implementation Method 2
Heat generated by components of the electronic device is transferred to the dielectric coolant
Implementation Method 3
a heat sink that is attached to the electronic component
Data Source
AI summary
An immersion cooling system includes a tank that contains a dielectric coolant. A main pump circulates the dielectric coolant through the tank and a heat exchanger. Electronic devices are submerged in the dielectric coolant in the tank. An electronic device includes a substrate, an electronic component that is mounted on the substrate, a heat sink that is attached to the electronic component, and a forced convection device that directs the dielectric coolant from within a housing of the electronic device toward the heat sink.