Integrated Microchannel Heat Sink for High-Flux IC Cooling
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Solution Overview
Problem
Existing IC thermal management techniques, particularly those using embedded microchannels, suffer from high flow resistance and limited thermal exchange efficiency, which is inadequate for advanced IC devices with high heat fluxes and localized hot spots.
Innovation Solution
An integrated heat sink structure with a plurality of closed-loop microchannels coupled to a hybrid active-passive micromixer chamber, controlled by an active oscillate input phase (OIP) control, enhances thermal exchange efficiency by managing the flow of liquids through multiple inlets and outlets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If embedded microchannels are used for cooling, then cooling coverage is provided, but flow resistance increases and thermal exchange efficiency is limited
Solution Approach 1:
The heat sink is divided into multiple discrete microchannel structures (first, second, third microchannels) with different configurations and orientations. Each microchannel segment handles specific thermal zones independently, allowing optimized flow paths for each segment rather than a single high-resistance embedded channel system.
Solution Approach 2:
The patent transitions from planar/embedded microchannels to a three-dimensional hierarchical structure with microchannels extending in multiple spatial dimensions. The first microchannel is adjacent to the die, the second is disposed over the first, and the third extends in a different orientation, creating vertical and lateral heat extraction pathways that reduce flow resistance through dimensional diversity.
2Productivity
If IC dimensions are downscaled to improve production efficiency and lower costs, then device density increases, but power density and heat flux increase causing thermal management challenges
Solution Approach 1:
The heat sink segments thermal management into multiple specialized microchannel structures, each optimized for specific heat flux zones. This segmentation allows the system to handle the increased power density from downscaled ICs by distributing thermal loads across multiple channels rather than overwhelming a single cooling path.
Solution Approach 2:
Different microchannel structures are positioned to address local thermal conditions: the first microchannel adjacent to the die handles immediate heat generation, the second microchannel over the first addresses secondary thermal zones, and the third microchannel in a different orientation targets specific hot spots. This local quality approach matches cooling capacity to local heat generation patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively increases thermal exchange efficiency by optimizing liquid flow and temperature management within the IC, addressing the thermal management challenges of advanced IC devices.
Implementation Method 1
a first microchannel adjacent to the integrated circuit die and a second microchannel disposed over the first microchannel
Implementation Method 2
through which a liquid coolant is configured to flow
Data Source
AI summary
One aspect of the present disclosure pertains to an integrated circuit (IC) structure. The IC structure includes a die and an integrated heat sink structure disposed over the die. In some embodiments, the integrated heat sink structure includes a first closed-loop microchannel structure adjacent to the die and a second closed-loop microchannel structure disposed over the first closed-loop microchannel structure. In an example, the second closed-loop microchannel structure is disposed further away from the die than the first closed-loop microchannel structure. In some implementations, a plurality of microchannels and a micromixer chamber collectively provide the first and second closed-loop microchannel structures.