Submersible Networking Enclosure With Dielectric Fluid Cooling
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Solution Overview
Problem
Existing telecommunications networking equipment in outside plant environments face challenges with heat and power demands, leading to increased energy consumption and material costs due to air-cooling methods, which require large enclosures and frequent maintenance.
Innovation Solution
A submersible enclosure with a dielectric fluid chamber for thermal dissipation, using a coolant circulator and distribution line to manage heat, combined with a secondary power source and accessible connection panel for networking components, reducing enclosure size and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-cooling methods (fans, heat exchangers, air conditioning units) are used to cool networking equipment, then cooling effectiveness is achieved, but energy consumption increases significantly and enclosure volume must be large
Solution Approach 1:
The patent replaces air-cooling systems with a liquid cooling system using dielectric fluid. The fluid is circulated through channels in contact with networking equipment components, absorbing heat and transporting it to external heat exchangers. This hydraulic cooling approach achieves superior heat removal efficiency while consuming less energy compared to air-based systems.
Solution Approach 2:
The patent changes the cooling medium from gas (air) to liquid (dielectric fluid), exploiting the higher specific heat capacity and thermal conductivity of liquids. This parameter change enables more effective heat absorption and transport, reducing the energy required for cooling while maintaining or improving temperature control.
2Temperature
If air-cooling methods are used, then cooling is provided, but enclosure volume must be large to provide ample volume for effective air cooling
Solution Approach 1:
The liquid cooling system uses fluid channels integrated into or adjacent to equipment components, allowing efficient heat removal in a compact configuration. The dielectric fluid circulates through these channels, providing high heat transfer coefficients that enable effective cooling without requiring large enclosure volumes.
Solution Approach 2:
The cooling channels are integrated within or alongside the networking equipment structure itself, nesting the cooling function within the equipment housing. This integration eliminates the need for separate large-volume cooling spaces, as the cooling infrastructure is embedded within the existing equipment footprint.
3Temperature
If air-cooled enclosures are used, then cooling is achieved, but material and equipment costs increase
Solution Approach 1:
The liquid cooling system replaces expensive air-cooling infrastructure (large fans, heat exchangers, air conditioning units) with a more efficient fluid-based system. The dielectric fluid circulation system requires smaller, less costly components while providing superior cooling performance, thereby reducing overall material and equipment costs.
4Temperature
If air-cooled enclosures are used, then cooling is provided, but frequent repair and replacement are needed
Solution Approach 1:
The liquid cooling system with dielectric fluid provides more reliable cooling with fewer maintenance requirements. The closed-loop fluid circulation system is more stable and requires less frequent intervention compared to air-cooled systems with moving parts like fans and complex air conditioning units, thereby improving overall system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enclosure effectively dissipates thermal energy, reduces power consumption by up to 50%, and minimizes maintenance needs, while maintaining operational efficiency and component protection.
Implementation Method 1
a dielectric fluid adapted to be disposed in the first chamber... The mounting mechanism is adapted to be submerged in the dielectric fluid
Implementation Method 2
a coolant circulator at least partially disposed within the shell. The coolant circulator is adapted to circulate the dielectric fluid within the first chamber of the shell via the coolant distribution line
Implementation Method 3
a heat sink operably coupled with the shell that is positioned between the coolant circulator and the coolant distribution line to dissipate thermal energy from the dielectric fluid
Implementation Method 4
dissipate thermal energy from the dielectric fluid exiting the coolant circulator before entering the coolant distribution line
Data Source
AI summary
An enclosure for retaining at least one networking component may include a shell forming a first chamber and a second chamber, a dielectric fluid adapted to be disposed in the first chamber, a mounting mechanism at least partially disposed within the first chamber, a coolant distribution line at least partially disposed within the first chamber, and a coolant circulator at least partially disposed within the shell. The mounting mechanism includes at least one coupling member adapted to retain at least one active networking component. The coolant distribution line includes an elongated member having at least one opening formed on a portion thereof. The coolant circulator is adapted to circulate the dielectric fluid within the first chamber of the shell via the coolant distribution line. The mounting mechanism is adapted to be submerged in the dielectric fluid.