Flexible Membrane Container for Variable-Size Electronic Cooling
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Solution Overview
Problem
Existing thermal management containers for electronic objects are rigid and inflexible, requiring separate designs for each size and configuration, leading to inefficiencies and high manufacturing costs, and are not adaptable to varying thermal management demands.
Innovation Solution
A flexible membrane container with adjustable size, shape, and volume, using a first flexible membrane, inflow and outflow conduits, and optional support frames to accommodate various electronic objects and dielectric coolants, allowing for customizable thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If rigid container walls are used, then structural strength is improved, but adaptability to different electronic object sizes and configurations deteriorates
Solution Approach 1:
The container employs flexible membrane walls that can dynamically change shape and volume to accommodate different electronic object sizes and configurations. The membrane structure allows the container to be expanded or contracted, and reshaped to match the contours of various electronic devices, providing both structural integrity and adaptability.
Solution Approach 2:
The container uses flexible membrane shells instead of rigid walls. These thin film structures provide sufficient strength to contain the dielectric coolant and support electronic objects while allowing the container to be deformed and resized to fit different device dimensions and cooling requirements.
2Manufacturing precision
If rigid container design is used, then manufacturing precision is improved, but ease of manufacture deteriorates due to high mold and die investment
Solution Approach 1:
The container design transitions from fixed rigid dimensions to variable flexible dimensions. The membrane structure can be manufactured in standard sizes and then adjusted to different final configurations through expansion, contraction, and shaping, eliminating the need for expensive custom molds for each device size.
Solution Approach 2:
A single flexible membrane container design can serve multiple device sizes and configurations, making the manufacturing process more universal. The same basic container structure can be adapted to fit various electronic objects, reducing manufacturing complexity and investment requirements.
3Adaptability or versatility
If container size is increased to accommodate largest electronic objects, then adaptability is improved, but volume efficiency deteriorates
Solution Approach 1:
The container volume is dynamic rather than fixed. It can be expanded to accommodate larger electronic objects when needed and contracted to reduce volume when smaller devices are housed, optimizing space utilization and eliminating the need for oversized containers to accommodate maximum device sizes.
Solution Approach 2:
The flexible membrane walls allow the container to conform closely to the shape and size of the electronic object inside, minimizing excess volume and improving space efficiency while maintaining the ability to accommodate various device sizes.
4Device complexity
If single circulation method is used, then device complexity is reduced, but adaptability to different thermal management demands deteriorates
Solution Approach 1:
The circulation system is designed to be dynamic and reconfigurable. The flexible container allows for adjustable coolant flow paths and circulation patterns that can be modified to meet different thermal management requirements of various electronic devices without requiring completely different circulation systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient thermal management of diverse electronic objects by adjusting the container's size and shape to match the object's dimensions, reducing excess volume, and facilitating heat exchange through flexible membranes and conduits, thereby optimizing thermal regulation.
Implementation Method 1
thermal management of an electronic object through immersion in dielectric heat transfer fluids
Implementation Method 2
The dielectric coolant is then either mechanically circulated (forced convection) or circulated through natural convection around or through the object in the container to thermally manage the electronic components
Data Source
AI summary
A flexible membrane container for thermal management of an electronic object, the flexible membrane container comprising a first flexible membrane defining a bag-like container having a first interior volume, the container having an opening for removably receiving an electronic object. At least one outflow conduit is disposed in fluid communication with the first interior volume, and at least one inflow conduit is disposed in fluid communication with the first interior volume, thereby enabling a liquid dielectric coolant from a source external to the flexible membrane container to enter into the first interior volume. An insert frame member having a header is configured for releasably attaching to the electronic object. The header provides controls and power connectivity for electronic communication with the electronic object.