Cooled Power Electromagnetic Assembly With Refrigerated Wall Heat Path

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Solution Overview

Problem

Existing cooled power electromagnetic devices struggle with inefficient cooling of power electromagnetic components and circuit boards, particularly power electronic semiconductors, leading to high temperatures and potential performance loss or damage.

Innovation Solution

A cooled power electromagnetic device design featuring a thermal conductive enclosure with integrated refrigerated walls and a heat transfer potting system, where power electromagnetic components are positioned to facilitate heat transfer from the circuit board to the refrigerated walls, utilizing parallel or dihedral configurations to enhance cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If power electromagnetic components are cooled using conventional cooling methods, then the cooling effect is insufficient, but the device complexity and cost increase when more advanced cooling systems are implemented

Engineering Contradiction:

Improvecooling effect on power electromagnetic componentsVSAvoidcooling system complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the cooling system with the enclosure structure by integrating cooling channels directly into the walls of the housing. This combination allows the enclosure to serve dual functions: mechanical protection and thermal management, thereby improving cooling effectiveness without increasing device complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The enclosure structure is designed to perform multiple functions simultaneously: it provides mechanical housing for components, thermal conduction pathways for heat transfer, and structural support. This multi-functionality eliminates the need for separate dedicated cooling components, reducing overall system complexity while enhancing cooling performance

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Power

If power electronic semiconductors operate at high current, then power output increases, but heat generation increases leading to overheating

Engineering Contradiction:

Improvepower output of power electronic semiconductorsVSAvoidtemperature of power electronic semiconductors

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent introduces thermal conduction paste as an intermediary substance between the power electronic semiconductors and the refrigerated walls. This mediator enhances heat transfer efficiency by filling micro-gaps and improving thermal contact, allowing high power operation without excessive temperature rise

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs liquid cooling through channels integrated into the enclosure walls, using fluid circulation to actively remove heat from the power electronic semiconductors. This hydraulic cooling system enables sustained high-power operation by continuously transporting heat away from the components

Inventive Principle:

Principle #29Pneumatics and hydraulics

3Temperature

If thermal conductive material is used for enclosure, then heat transfer improves, but manufacturing cost increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent segments the enclosure into modular sections with integrated cooling channels, allowing the thermal conductive material to be strategically applied only where heat transfer is critical. This segmentation enables cost-effective manufacturing by limiting expensive material usage to high-need areas while maintaining overall heat transfer efficiency

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design provides effective heat dissipation, maintaining component performance and preventing overheating, while being cost-effective and easy to assemble, allowing for high energy density applications.

Implementation Method 1

a heat transfer potting filling gaps between the power electromagnetic components, the circuit board and the enclosure structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least one refrigerated wall with a cooling flow path integrated therein

Methodology Applied

Scientific EffectConvective heat transfer: Convection

Data Source

PatentEP4648559A1Cooled power electromagnetic device

Publication Date: 2025.11.12 PREMO SL

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AI summary

Cooled power electromagnetic device comprising an enclosure structure (10), including at least one refrigerated wall (11), housing power electromagnetic components (20), a circuit board (30) with power electronic semiconductors (31) and a heat transfer potting (40), wherein the power electromagnetic components (20) contain or are attached or are adjacent to the at least one refrigerated wall (11); wherein the power electromagnetic components (20) are attached or facing the circuit board (20), the circuit board (30) and the at least one refrigerated wall (11) are parallel to each other; or the circuit board (30) and the at least one refrigerated wall (11) define a dihedral, the power electromagnetic components (20) or parts thereof being interposed between the at least one refrigerated wall (11) and the circuit board (30); the power electromagnetic components (20) providing a thermal path therethrough for the transfer of heat towards the at least one refrigerated wall (11).