Power Module Pressing Structure for Adhesive-Free Thermal Contact
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Solution Overview
Problem
The aging of thermal conductive adhesives in power modules reduces heat dissipation efficiency due to gaps forming between power components and cooling plates, leading to increased thermal resistance and decreased reliability.
Innovation Solution
A power module design that includes a pressing structure to tightly press the power transistor against a thermal conductor and cooling plate, using a fastener to maintain a stable connection, and incorporates an elastic member and insulating member to ensure consistent attachment and insulation, thereby improving heat dissipation and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal conductive adhesive is used to attach power component to cooling plate, then initial heat dissipation effect is achieved, but after long-term use the adhesive ages and gaps form reducing heat dissipation efficiency
Solution Approach 1:
The patent removes the thermal conductive adhesive from the heat conduction path between the power transistor and cooling plate. Instead, the power transistor body directly contacts the cooling plate through the pressing structure, eliminating the adhesive layer that would age and form gaps. This extraction of the problematic adhesive while maintaining thermal contact resolves the contradiction between initial heat dissipation effectiveness and long-term reliability.
Solution Approach 2:
The pressing structure is pre-configured to apply continuous pressure to the power transistor body, ensuring it maintains tight contact with the cooling plate throughout the service life. This preliminary mechanical constraint prevents gap formation before aging can occur, addressing the long-term reliability issue without requiring adhesive materials that degrade over time.
2Productivity
If power module size is decreased to meet fast charging requirements, then power density increases, but heat generation becomes more severe requiring improved heat dissipation
Solution Approach 1:
The patent transitions from a planar attachment geometry to a three-dimensional pressing structure that applies force from multiple directions. The pressing structure encompasses the power transistor body and applies pressure toward the cooling plate, creating a dimensional approach that maximizes thermal contact area and heat dissipation efficiency within the constrained small form factor, thereby managing severe heat generation in high-power-density modules.
3Reliability
If pressing structure is added to maintain tight contact, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the pressing structure with the existing module housing or casing, integrating the heat dissipation function into an existing structural element rather than adding a completely separate component. This merging approach maintains tight thermal contact between the power transistor and cooling plate while minimizing the increase in overall device complexity by utilizing available structural space and materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation efficiency and reliability by maintaining close contact between the power transistor, thermal conductor, and cooling plate, reducing thermal resistance and extending the service life of the circuit board.
Implementation Method 1
an elastic member, the elastic member elastically abuts against the body and the elastic member is configured to exert an elastic force on the body in a direction toward the cooling plate
Implementation Method 2
a thermal conductor... The pressing structure is configured to tightly press the body and the thermal conductor... shorten a heat conduction path from the power transistor through the thermal conductor to the cooling plate
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3~4
AI summary
A power module and a charging device are provided. The power module includes a circuit board, a power transistor, a thermal conductor, a cooling plate, and a pressing structure. The cooling plate, the thermal conductor, the pressing structure, and the circuit board are sequentially stacked. The power transistor includes a body and a pin. The pin is exposed from the body. The body is located between the thermal conductor and the pressing structure. The pin passes through the pressing structure and is connected to the circuit board. The pressing structure is configured to tightly press the body and the thermal conductor. The pressing structure tightly presses the body and the thermal conductor, so that the body tightly presses the thermal conductor against the cooling plate, and the thermal conductor can be closely attached to the body and the cooling plate. This can reduce a possibility of forming a gap between the power transistor and the thermal conductor or between the thermal conductor and the cooling plate, thereby helping improve a heat dissipation capability of the power transistor.