Liquid Cooling Module Diversion Structure for Uniform Parallel Flow
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Solution Overview
Problem
Existing liquid cooling systems for elongated arrangements of electronic devices suffer from temperature differences and increased flow impedance, leading to reduced reliability and efficiency in heat dissipation.
Innovation Solution
A liquid cooling module with a diversion structure that divides cooling fluid evenly into parallel flow channels, allowing for uniform heat dissipation across multiple devices by using a housing base with inflow and outflow chambers and manifold chambers connected by perpendicular flow channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a series-connected cooling channel is used for elongated electronic devices, then the design is simple, but the temperature difference between upstream and downstream fins increases and reliability decreases
Solution Approach 1:
The cooling channel is divided into multiple parallel independent channels instead of a single series channel. Each channel serves specific fins, allowing cooling fluid to flow simultaneously through multiple paths, thereby reducing the temperature difference between upstream and downstream regions and improving overall reliability.
2Device complexity
If a continuous fin design is used, then the structure is simple, but the working fluid impedance increases greatly and flow rate decreases
Solution Approach 1:
The continuous fin structure is segmented into multiple independent fin groups, each with its own cooling channel. This segmentation reduces the total flow impedance by creating parallel flow paths, allowing cooling fluid to flow through multiple channels simultaneously and maintaining higher flow rates.
Solution Approach 2:
The cooling channels are arranged in a three-dimensional configuration with multiple parallel channels extending through the fin structure. This dimensional arrangement creates parallel flow paths that reduce impedance and maintain flow rate compared to a single continuous channel.
3Length of moving object
If cooling fluid flows through elongated lateral sides, then the flow path is long, but the heat dissipation uniformity decreases
Solution Approach 1:
The long flow path is segmented into multiple shorter parallel channels. Each channel has a reduced length, which improves heat dissipation uniformity by reducing the temperature gradient along the flow direction. The segmentation allows cooling fluid to reach all fins more effectively and uniformly.
Solution Approach 2:
The flow channels are oriented perpendicular to the elongated lateral sides rather than along them, creating a short path design. This dimensional change reduces the flow path length and improves heat dissipation uniformity across all electronic devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature differences and flow impedance, improving heat dissipation efficiency and ensuring uniform cooling across multiple devices.
Implementation Method 1
manifold chambers configured to be thermally coupled with a plurality of fins
Implementation Method 2
cooling fluid entering the inflow chamber is evenly divided into equal portions and then enters a plurality of diversion chambers through a plurality of through holes
Data Source
Figure 1
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Figure 3
AI summary
A liquid cooling module (3, 3, 3b, 3c, 3d) and a heat dissipation assembly (1, 1a, 1b, 1c, 1d) using the same are disclosed. The liquid cooling module (3, 3, 3b, 3c, 3d) includes a housing base (2, 2a, 2b, 2c, 2d, 2e, 2f, 2g) with an inflow chamber (21), an outflow chamber (22), manifold chambers (41, 41b, 41c), a partition wall (20, 20a), first through holes (23a, 23b, 23c), second through holes (24a, 24b, 24c) and a diversion structure (25, 25a, 25b, 25c, 25d, 25c, 25f, 25g, 25h, 33a, 33b). The inflow chamber (21) and the outflow chamber (22) are disposed on a first surface (101), and divided by the partition wall (20, 20a). The manifold chambers (41, 41b, 41c) are disposed on a second surface (102). The first through holes (23a, 23b, 23c) and the second through holes (24a, 24b, 24c) are disposed adjacent to two opposite elongated sides, and arranged along a first direction. The manifold chambers (41, 41b, 41c) are in communication with the inflow chamber (21) through the first through holes (23a, 23b, 23c), and in communication with the outflow chamber (22) through to the second through holes (24a, 24b, 24c). The diversion structure (25, 25a, 25b, 25c, 25d, 25c, 25f, 25g, 25h, 33a, 33b) protruding toward the inflow chamber (21) or the outflow chamber (22) provides a diversion function to achieve a uniform flow rate of the parallel flow channels (F 1, F2, F3).