Composite End Effector Embedding Sensors for Low Profile
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing end effectors for substrate handling in semiconductor and solar cell fabrication have increased profile and thickness due to sensors and components, leading to surface irregularities that complicate cleaning and prolong manufacturing processes.
Innovation Solution
A composite end effector design featuring a lower and upper sandwich panel with an intermediate element, such as an electrical conductor or optical fibers, embedded between the panels to integrate sensors and components while maintaining a flat, easy-to-clean surface, reducing the overall profile and facilitating cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensors and components are mounted on the top and/or bottom surfaces of an end effector, then the end effector can detect presence or absence of substrates and securely clamp substrates, but the overall profile and thickness of the end effector increases
Solution Approach 1:
The patent embeds sensors and components within the internal structure of the end effector, nesting them between the top and bottom surfaces rather than mounting them externally. This allows the end effector to maintain substrate detection and clamping capabilities while reducing its overall thickness and profile.
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional internal embedding, relocating sensors and components from the external surfaces to the internal volume of the end effector. This dimensional change enables reduced thickness while preserving functionality.
2Reliability
If sensors and components are mounted on the top and/or bottom surfaces of an end effector, then the end effector can detect presence or absence of substrates and securely clamp substrates, but surface irregularities are created that complicate cleaning
Solution Approach 1:
By nesting sensors and components within the internal structure of the end effector, the patent eliminates surface irregularities that would otherwise complicate cleaning. The smooth external surfaces can be easily cleaned while the embedded components remain protected internally.
Solution Approach 2:
The patent extracts sensors and components from the external surfaces and relocates them to the internal structure, separating the functional elements from the cleaning surface. This extraction resolves the conflict between having functional components and maintaining easy-to-clean surfaces.
3Reliability
If sensors and components are mounted on the top and/or bottom surfaces of an end effector, then the end effector can detect presence or absence of substrates and securely clamp substrates, but manufacturing time is prolonged due to complex cleaning requirements
Solution Approach 1:
The patent embeds sensors and components within the internal structure, creating smooth external surfaces that require minimal cleaning time. This nesting approach reduces manufacturing delays while preserving substrate detection and clamping functions.
Solution Approach 2:
By extracting components from the surface and relocating them internally, the patent eliminates the need for complex cleaning procedures, thereby reducing manufacturing time and improving productivity without sacrificing functional reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a low-profile, stiff, and contamination-free end effector with smooth surfaces, enabling efficient substrate handling and reducing manufacturing delays by embedding sensors and components within the end effector's structure, maintaining planarity and ease of cleaning.
Implementation Method 1
electrostatic chucks ('e-chucks') that are capable of producing electrostatic forces for securely clamping substrates to an end effector during transport and/or processing
Implementation Method 2
an upper sandwich panel having a first side and a second side opposite the first side, wherein the first side of the upper sandwich panel is bonded to the first side of the lower sandwich panel
Data Source
AI summary
A composite end effector including a lower sandwich panel having a first side and a second side opposite the first side, an upper sandwich panel having a first side and a second side opposite the first side, wherein the first side of the upper sandwich panel is bonded to the first side of the lower sandwich panel, and an intermediate element disposed between the second side of the lower sandwich panel and the second side of the upper sandwich panel. The intermediate element may include an electrical conductor, wherein an electrostatic chuck is electrically coupled to the electrical conductor through an aperture in the upper sandwich panel. Alternatively or additionally, the intermediate element may include a pair of optical fibers disposed within a pair of channels formed in at least one of the first side of the upper sandwich panel and the first side of the lower sandwich panel.