Composite Electronic Component Integrating ESD Protection and Capacitance

The patent combines the ESD protecting element with the multilayer capacitor into a single composite electronic component. The ESD element and capacitor share a common body structure and are electrically connected through internal electrodes, allowing both ESD protection and capacitance functions to be achieved within one component footprint, thereby improving ESD resistance without increasing the mounting area on the circuit board.

The patent employs a composite structure where the ESD protecting element and multilayer capacitor are integrated within a single body. The body comprises multiple dielectric layers and internal electrodes that provide both electrical functionality and mechanical reinforcement. This composite architecture achieves space efficiency while maintaining robust mechanical strength through the multi-layer construction and interlocking electrode structures.

The composite electronic component performs multiple functions within a single device: it provides capacitance for power filtering and decoupling, ESD protection for electrical stress resistance, and thermal management for stability under thermal stress. The integrated body structure with multiple dielectric layers and internal electrodes simultaneously achieves all these functions, improving reliability against thermal and electrical stress while avoiding the need for separate components that would increase device complexity.