Composite Integrated Film for Dense Micro-LED Defect Replacement
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Solution Overview
Problem
Micro-LED display manufacturing processes face challenges in reducing defective rates and increasing packaging density, as existing techniques require redundant LED elements and spaces on the circuit board, limiting the integration and resolution of display pixels.
Innovation Solution
A composite integrated film with a base member thin film, penetration parts, electrodes, and elements is used, where the electrode surfaces are joined to connection pads on a circuit board by intermolecular forces, allowing for easy defect elimination and increased packaging density without the need for redundant components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If redundant LED elements are mounted on the circuit board to eliminate defects, then manufacturing yield is improved, but packaging density and pixel density decrease
Solution Approach 1:
The invention divides the LED element into two separate components: a light-emitting element and an electrode structure. The electrode structure with penetration parts is mounted on the circuit board first, and the light-emitting element is transferred onto it later. This segmentation allows the electrode structure to serve as a reusable base that doesn't require redundant instances for defect compensation, thereby maintaining high pixel density while improving manufacturing yield through the transfer process.
Solution Approach 2:
The electrode structure with penetration parts is prepared and mounted on the circuit board in advance, before the light-emitting elements are transferred. This preliminary action creates a stable foundation that can accommodate light-emitting elements without requiring redundant electrode structures, thus enabling high pixel density while facilitating easy replacement of defective light-emitting elements through the transfer process.
2Ease of manufacture
If spaces are provided for redundant LED elements on the circuit board, then defect elimination becomes easier, but device integration and resolution are limited
Solution Approach 1:
By separating the electrode structure from the light-emitting element and mounting only the electrode structure on the circuit board, the invention eliminates the need for redundant spaces. The penetration parts in the electrode structure enable easy transfer and replacement of light-emitting elements, achieving ease of manufacture for defect elimination without compromising device integration.
Solution Approach 2:
The invention transitions from a planar mounting approach to a three-dimensional structure with penetration parts extending through the electrode structure. This dimensional change allows the light-emitting element to be transferred onto the electrode structure from above, enabling easy defect elimination without requiring additional horizontal space on the circuit board, thus maintaining high integration levels.
3Reliability
If flip-chip bonding is used to mount LED elements, then electrical connection is achieved, but defect removal damages electrodes and complicates re-mounting
Solution Approach 1:
The invention separates the electrode structure with penetration parts from the light-emitting element. The electrode structure remains permanently mounted on the circuit board with secure electrical connections, while the light-emitting element is transferred onto it. This segmentation allows defective light-emitting elements to be removed and replaced without disturbing the electrode structure or damaging the circuit board electrodes, significantly easing repair and re-mounting processes.
Solution Approach 2:
The penetration parts in the electrode structure serve as an intermediary mechanism between the circuit board and the light-emitting element. These penetration parts provide a stable interface that maintains electrical connection while allowing the light-emitting element to be transferred and replaced without direct bonding to the circuit board, thus preventing damage to circuit board electrodes during defect removal and re-mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient defect removal and increased packaging density, enhancing the manufacturing yield and resolution of micro-LED displays by eliminating the need for redundant components and spaces, while maintaining a high level of integration and efficiency in the manufacturing process.
Implementation Method 1
the electrode surfaces are joined to connection pads on a circuit board by intermolecular forces
Data Source
AI summary
A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.