Composite Heat Sink with Thermal Insulation for Decoupled Cooling

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Solution Overview

Problem

In electrically-driven devices packed in close proximity, thermal coupling occurs, leading to heat transfer between devices, which can deteriorate performance and lifespan due to inadequate heat dissipation mechanisms.

Innovation Solution

A composite heat sink device with multiple thermal conduction members and a thermal insulation member is used to thermally decouple heat sinks, allowing each device to dissipate heat independently, preventing heat transfer between them.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple electrically-driven devices are packed in close proximity in a small form factor, then device functionality and integration are improved, but thermal coupling occurs causing heat transfer between devices which deteriorates performance and lifespan

Engineering Contradiction:

Improvedevice functionalityVSAvoiddevice performance and lifespan

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The heat sink is divided into multiple thermally isolated segments or zones, each corresponding to a specific heat-generating device. These segments are thermally decoupled through insulation structures, allowing independent heat dissipation pathways for each device while maintaining close physical proximity for compact packaging.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Thermal insulation structures are introduced as intermediary elements between adjacent heat-generating devices and their corresponding heat sink regions. These insulation layers or barriers prevent direct thermal coupling while allowing each device to maintain effective thermal contact with its dedicated heat dissipation path.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If heat sinks are thermally coupled to multiple devices in close proximity, then heat dissipation capacity is improved, but heat generated by one device transfers to adjacent devices causing temperature rise

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidheat transfer between devices

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The heat sink structure is segmented into multiple thermally isolated zones, each dedicated to a specific heat-generating device. This segmentation creates independent heat dissipation pathways that prevent thermal cross-contamination while maintaining high heat dissipation capacity for each device.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the heat sink are designed with locally optimized thermal properties. Each local region is thermally tailored to efficiently dissipate heat from its corresponding device, while thermal insulation at boundaries prevents heat transfer to adjacent regions. This allows high heat dissipation capacity locally without harmful thermal coupling.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces thermal coupling, enhancing the performance and lifespan of electrically-driven devices by ensuring efficient heat dissipation without transferring heat between adjacent devices.

Implementation Method 1

The first thermal conduction member may be disposed on the first electrically-driven device such that at least a portion of the heat generated by the first electrically-driven device is transferred to the first thermal conduction member by conduction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The second thermal conduction member may be disposed on the second electrically-driven device such that at least a portion of the heat generated by the second electrically-driven device is transferred to the second thermal conduction member by conduction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The thermal insulation member may be disposed between the first thermal conduction member and the second thermal conduction member and may thermally decouple the first thermal conduction member and the second thermal conduction member from one another

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS9980363B2Composite heat sink device for cooling of multiple heat sources in close proximity

Publication Date: 2018.05.22 KIM GERALD HO

AI summary

In one aspect, an apparatus comprises a substrate, a first electrically-driven device disposed on the substrate, a second electrically-driven device disposed on the substrate, and a composite heat sink device. The composite heat sink device comprises a first thermal conduction member, a second thermal conduction member, and a thermal insulation member. The first thermal conduction member is disposed on the first electrically-driven device such that at least a portion of the heat generated by the first electrically-driven device is transferred to the first thermal conduction member by conduction. The second thermal conduction member is disposed on the second electrically-driven device such that at least a portion of the heat generated by the second electrically-driven device is transferred to the second thermal conduction member by conduction. The thermal insulation member is disposed between and thermally decouples the first thermal conduction member and the second thermal conduction member from one another.