Composite Imaging Substrate for Thermal Distortion Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional imaging devices face challenges in maintaining the positional relationship between the imaging element and the imaging lens due to thermal expansion and deformation caused by temperature changes, leading to reduced image quality.
Innovation Solution
The use of a substrate formed from both organic and inorganic materials with insulation layers, where the organic substrate has a higher thermal expansion coefficient and the inorganic substrate has a lower thermal expansion coefficient, helps to adjust distortion and maintain the positional relationship between the imaging element and the imaging lens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetic sealing is performed to prevent dust entry, then sealing reliability is improved, but internal pressure changes cause deformation and positional relationship failure
Solution Approach 1:
The patent introduces a breathable resin with microporous structure into the hermetic sealing system. This porous material allows internal pressure equalization through the resin layers, preventing pressure-induced deformation while maintaining the hermetic seal against dust entry. The micropores are small enough to block particles but large enough to permit gas permeation.
Solution Approach 2:
The patent creates a composite sealing structure combining breathable resin layers with traditional hermetic sealing materials. The composite structure integrates the pressure-equalizing function of porous resin with the dust-blocking function of hermetic sealants, resolving the contradiction between sealing reliability and positional precision.
2Strength
If heating is performed to cure adhesive, then bonding strength is improved, but internal pressure increase causes positional relationship failure
Solution Approach 1:
The breathable resin layers are positioned to allow pressure equalization during the adhesive curing heating process. The microporous structure permits gradual pressure release, enabling complete adhesive cure without pressure-induced deformation that would compromise positional relationships.
3Adaptability or versatility
If members with different thermal expansion coefficients are used, then functional requirements are met, but thermal deformation causes positional relationship failure
Solution Approach 1:
The patent explicitly addresses thermal expansion differences between imaging elements and substrate by incorporating breathable resin that can accommodate dimensional changes. The resin's compressibility and microporous structure allow thermal expansion/contraction without transmitting deforming forces that would misalign optical components.
Solution Approach 2:
The composite structure combining rigid components (imaging elements, substrate) with compliant breathable resin creates a thermally adaptive assembly. The resin acts as a buffer that absorbs thermal stress, maintaining positional relationships despite differential thermal expansion of functional components.
4Reliability
If through-hole is formed and filled with breathable resin, then internal pressure increase is suppressed, but deformation due to other factors still occurs
Solution Approach 1:
The patent extends the breathable resin application from simple through-hole filling to multiple resin layers integrated throughout the sealing structure. This comprehensive porous material integration provides both pressure equalization and thermal deformation compensation functions simultaneously.
Solution Approach 2:
The patent creates a multi-layer composite structure combining breathable resin with hermetic sealing materials. This composite approach provides dual functionality: pressure stability through resin permeability and deformation resistance through the rigid hermetic sealant layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces deformation of the imaging device due to temperature changes, thereby preventing a reduction in image quality and improving the reliability and airtightness of the device.
Implementation Method 1
an increase in internal pressure is suppressed even when the air in the imaging device is expanded, since the expanded air is dissipated outward through the breathable resin
Implementation Method 2
These members are distorted when they are expanded or contracted in response to a change in temperature that is caused when they are used
Data Source
AI summary
To reduce deformation of an imaging device and to prevent a reduction in image quality. The imaging device includes an imaging element, a substrate, and a connection portion. The substrate included in the imaging device is formed of an organic substrate and an inorganic substrate, the organic substrate including an insulation layer that is made of an organic material, the inorganic substrate including an insulation layer that is made of an inorganic material. The imaging element included in the imaging device is bonded to the substrate. The connection portion included in the imaging device connects the substrate included in the imaging device and the imaging element included in the imaging device.