Composite Material Laser Division Without Brittle-Layer Cracks
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Solution Overview
Problem
Existing methods for dividing composite materials with laminated brittle and resin layers either cause cracks in the brittle material layer or deteriorate the quality of the resin layer's end portion.
Innovation Solution
A method involving laser beam processing, where the resin layer is first irradiated to form a processing groove, followed by irradiation of the brittle material layer with an ultrashort pulsed laser to form a processing mark, and finally, heat is applied from the opposite side of the resin layer to generate thermal stress and divide the brittle material layer without causing cracks or degrading the resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the resin layer is processed with a laser beam and the brittle material layer is processed with a mechanical tool, then the composite material can be divided, but cracks are generated in the end face of the brittle material layer
Solution Approach 1:
The patent replaces the mechanical tool with a laser beam processing system for the brittle material layer. Specifically, it uses an ultrashort pulsed laser beam to form processing marks that enable clean division without mechanical contact, thereby eliminating cracks in the end face while maintaining division capability.
Solution Approach 2:
The patent changes the laser beam parameters by using ultrashort pulsed laser beams with specific pulse widths (10^-12 to 10^-9 seconds) and controlling the pulse repetition frequency and irradiation speed. This parameter optimization allows the laser to process the brittle material layer without causing thermal damage or cracks, achieving both division and high end face quality.
2Manufacturing precision
If an ultrashort pulsed laser beam is irradiated from the brittle material layer side to divide the composite material, then the brittle material layer can be divided without cracks, but the resin layer end portion deteriorates due to thermal degradation
Solution Approach 1:
The patent inverts the processing sequence by first processing the resin layer with a conventional laser beam to create a processing groove, then processing the brittle material layer from the opposite side with an ultrashort pulsed laser beam. This inversion ensures that the ultrashort pulsed laser beam does not directly irradiate the resin layer, preventing thermal degradation while maintaining the crack-free division benefit.
Solution Approach 2:
The patent segments the division process into two distinct steps: first processing the resin layer with a conventional laser beam, then processing the brittle material layer with an ultrashort pulsed laser beam. This segmentation allows each material layer to be processed with the most appropriate laser type, optimizing both the division quality and preventing cross-contamination of processing effects.
3Productivity
If a conventional laser beam is used to process the brittle material layer, then the resin layer can be processed effectively, but the brittle material layer develops cracks at the end face
Solution Approach 1:
The patent divides the processing into two segmented steps: using a conventional laser beam for the resin layer (maintaining high productivity) and an ultrashort pulsed laser beam for the brittle material layer (ensuring high precision without cracks). This segmentation allows each laser type to optimize its performance for the specific material it processes.
Solution Approach 2:
The patent applies different laser processing qualities to different material layers: conventional laser processing for the resin layer (where thermal processing is acceptable) and ultrashort pulsed laser processing for the brittle material layer (where minimal thermal impact is required). This local quality differentiation resolves the contradiction between productivity and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the division of composite materials without generating cracks in the brittle material layer and without deteriorating the quality of the resin layer's end portion, ensuring precise and high-quality cutting.
Implementation Method 1
irradiating the resin layer with a laser beam oscillated from a first laser source along a scheduled dividing line of the composite material to remove a resin forming the resin layer
Implementation Method 2
irradiating the brittle material layer with a laser beam oscillated from an ultrashort pulsed laser source along the scheduled dividing line to remove a brittle material forming the brittle material layer
Implementation Method 3
applying heat to the brittle material layer from an opposite side to the resin layer along the scheduled dividing line to generate thermal stress in the brittle material layer, to thereby divide the brittle material layer
Data Source
AI summary
A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including: a resin removing step of irradiating the resin layer with a laser beam oscillated from a first laser source along a scheduled dividing line of the composite material to form a processing groove along the scheduled dividing line; a brittle material removing step of irradiating the brittle material layer with a laser beam oscillated from an ultrashort pulsed laser source along the scheduled dividing line to form a processing mark along the scheduled dividing line; and a brittle material layer dividing step of generating thermal stress in the brittle material layer by irradiating the brittle material layer with a laser beam oscillated from a second laser source from the opposite side to the resin layer to thereby divide the brittle material layer.