Composite Laser Cutting with Opposed Cutouts for Thick Sections

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Solution Overview

Problem

Existing laser machining methods for composite materials result in a V-shaped cutting groove, leading to increased path numbers and removal volume, which prolongs the cutting time as thicker materials require more extensive removal on the front surface.

Innovation Solution

A laser machining method and device that cuts composite materials by forming first and second cutouts on opposite sides, allowing them to communicate, reducing removal volume and improving machining speed by alternating or simultaneously performing cutting steps without the need for simultaneous dual-sided cutting devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If machining is performed by irradiating from one side only, then device complexity is reduced, but removal volume increases and machining time is prolonged

Engineering Contradiction:
Improvedevice complexityVSAvoidmachining time
Core Design Contradiction:
Device complexityVSLoss of time

Solution Approach 1:

The patent divides the cutting process into two separate operations: a cutting-out step that forms a first cutout from one side, and a cutting step that forms a second cutout from the opposite side. These two operations are performed sequentially using a single laser device, thereby reducing device complexity while minimizing total removal volume and machining time

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces bidirectional machining by performing cutting operations from both the front surface side and the back surface side of the composite material. This dual-directional approach reduces the total removal volume required compared to unidirectional machining, thereby reducing machining time without requiring complex dual-sided simultaneous machining equipment

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If machining is performed by irradiating from one side only, then device complexity is reduced, but removal volume increases

Engineering Contradiction:
Improvedevice complexityVSAvoidremoval volume
Core Design Contradiction:
Device complexityVSLoss of substance

Solution Approach 1:

The cutting process is segmented into two phases: first forming a cutout from one side, then forming a corresponding cutout from the opposite side. This segmentation allows the total removal volume to be minimized by removing material from both directions rather than requiring extensive removal from a single side

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By performing cutting operations from both the front and back surfaces of the composite material, the patent reduces the total volume of material that must be removed. This bidirectional approach is particularly effective for thick composite materials where unidirectional removal would require excessive material removal and time

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If multiple paths are used to form cutouts, then cutting precision is improved, but path number increases and machining time is prolonged

Engineering Contradiction:
Improvecutting precisionVSAvoidmachining time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent segments the cutting operation into two main paths: a cutting-out path that forms the first cutout, and a cutting path that forms the second cutout. By dividing the work this way and performing operations from both sides, the total number of passes required is reduced compared to forming the entire cutout from one side, thereby reducing machining time while maintaining precision

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces bidirectional cutting paths by performing machining from both the front surface side and the back surface side. This approach reduces the total path length and number of passes required compared to unidirectional multi-path machining, thereby reducing machining time while achieving precise cutouts

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the removal amount and enhances machining speed by forming cutouts on opposite sides of the composite material, allowing for efficient cutting with reduced device complexity and preventing unnecessary laser exposure.

Implementation Method 1

a first step of irradiating a machining target site of the composite material with a high output power laser beam

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS12023760B2Laser machining method and laser machining device
Publication Date: 2024.07.02 MITSUBISHI HEAVY IND LTD
  • US12023760B2 patent drawing
  • US12023760B2 patent drawing
  • US12023760B2 patent drawing

AI summary

A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.