Welding/Soldering/Cutting Articles TRIZ Cases

Movable laser energy adjustment matches wafer material regions to keep trench depths consistent and limit seal ring damage during dicing.

A birefringent retarder plate switches laser beam forms by polarization, enabling precise bevel machining with less optical reconfiguration.

A laser pre-pulse transiently changes semiconductor properties to sharpen 3D writing, improve control, and enable erasable modifications.

Pulsed laser cutting sublimates lithium foil instead of melting it, reducing bead formation, splashes, and battery short-circuit risk.

A multi-region laser beam stabilizes the molten pool to cut sputter, limit contamination, and maintain weld strength at varied sweep speeds.

A stepped pin and tool tilt hold down flowing metal in friction stir welding, limiting burrs and improving joint strength.

Acute-angled apexes and rounded depressions guide ultrasonic weld flow to cut burrs, shrink joint footprint, and improve connection reliability.

Partial-height joints keep laser-cut scrap skeleton sections connected during unloading, then allow easy breakup for disposal without tilting.

Combining concentration, half-life, agglomeration, and floating models predicts when reinforcing particles separate in composite solder.

Combining AOD and galvano beam deflection enables faster multi-site drilling with layer-specific laser energy control for copper and resin substrates.

A controlled laser scan start angle and lower upper-side energy density suppress keyhole growth and hole defects in upright stacked plate welding.

A folded foil stack lets laser welding join more battery foils to a carrier without seam gaps or tearing at the weld border.

Tapered pipe end shaping, external heating, and plastic deformation direct burrs outward to preserve inner diameter and joint strength.

A female-ID outer race and male-OD powder metal gear are joined by brazing, welding, or staking to raise strength without full-density cost.

Opposed rotating tools on both plate surfaces balance heat and plastic flow, enabling faster friction stir welding with fewer defects.

Crosshatched laser ablation deepens bond intersections to help golf club head adhesive joints resist repeated high-force impacts.

Pulse-laser roughening forms protrusions wider than adjacent concavities, improving metal-resin anchor effect and joining strength.

A second, wider laser beam stirs the weld pool in dissimilar metal joining to suppress cracking and intermetallic compounds.

Light-shielding defect detection and dual-sided modified layers help slice brittle wafers without chips or cracks.

Real-time imaging adjusts QCW laser power during 3D writing to stabilize refractive index changes and reduce cost and scalability limits.

A spring-biased spindle adapts axial force to surface height changes, maintaining FSP penetration depth and reducing defects on non-planar workpieces.

Predetermined-wavelength energy, abrasion, and silane treatment prepare aluminum surfaces for stronger adhesive bonds with lower energy use.

Laser heating bakes out hydrogen from pipelines and vessels in place, reducing embrittlement without disassembly or uneven torch heating.

An inclined laser focus shaped by a spatial light modulator redirects leaked light away from vulnerable wafer structures while preserving fracture control.

High-rate Gaussian laser pulses drill uniform through-vias in transparent substrates without acid etching, improving speed and interposer quality.

Dual-side laser preheating improves plastic flow in structural steel friction stir bonding, raising joint strength and reducing rotary tool load.

Two-stage laser focusing controls fluence in recessed features to suppress film formation while maintaining precise workpiece processing.

Multiple laser beamlets and orthogonal mirror scanning speed substrate perforation, overcoming slow galvo drilling in aerostructures.

Pre-attached hard protective layers and automated series welding reduce small cell breakage and improve quality in rollable silicon modules.

A stepped dual-pin rotary tool stirs the softer sealing member to improve liquid-cooling jacket joint strength and water-tightness.

Heat radiation sensing during laser machining detects cracks, contamination, and warpage in real time to improve inspection and yield.

A gimbal-mounted welding shoulder with push-pull rods and piezo adjustment changes attack angle during friction stir welding without delay.

A reflective-refractive film localizes laser energy to create transparent hermetic substrate bonds at lower temperatures with less bubble formation.

Phase-shaped, polarized partial beams create a curved, asymmetrical focal zone for precise glass machining and controlled crack alignment.

Selectable axicon and facet lenses let one laser machining head switch Gaussian, flat, and ring beams while stopping output during movement.

A spatial light modulator splits laser beams to form a modified region that blocks non-modulated light and protects opposite-side functional layers.

A stiff sonic-welded lignin-cellulose disperser replaces loose tea bag strings, reducing mess, fingertip burns, and compostable waste.

Individually controlled laser outputs replace moving mirrors to keep packaging web marks accurate at speeds above 400 m/min.

A form-fit optical guide and index-matched liquid medium let laser beams weld through curved or rough glass with less refraction, clipping, and energy loss.

Staggered multi-head laser paths, vacuum substrate holding, and robotic transfer boost optical device throughput without deformation.

High-frequency pulsed laser settings balance dicing speed and wafer integrity by limiting crack growth along compound semiconductor crystal structures.

Selective laser welding bonds metal foil only where connections need tailored surface properties, avoiding costly coating removal and preserving weldable areas.

Opposed laser cutouts from both sides reduce V-shaped groove removal in thick composites, shortening machining time without dual-sided equipment.

A phase-modified laser focal line creates angled defects in transparent glass, enabling stronger edges, dust-free separation, and high throughput.

Selective laser welding bonds metal foil only where force connections need it, preserving clean weld areas and smooth surfaces.

Laser cutting, folding, release, and ablation propulsion create freely moving actuator parts without extra handling or assembly.

A beam focal line longer than ceramic thickness creates kerf-free damage tracks, preserving edge strength and thermal conductivity.

Periodic CW laser modulation excites capillary waves to eject melt more efficiently, cutting energy use, overheating, and cracking.

A split laser beam matrix enables high-resolution 3D panel structuring at higher throughput, creating realistic wood- or stone-like surfaces.

Timed femtosecond pulse trains create regular sub-130 nm surface patterns without vacuum, improving precision and throughput in laser nanostructuring.