Staggered Laser Dicing Heads for Deformation-Free Optical Singulation
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Solution Overview
Problem
Current systems for processing optical devices with sub-micron critical dimensions on substrates are throughput limited and prone to deformation during handling and separation, requiring methods to enhance processing efficiency without damaging the devices.
Innovation Solution
A laser dicing system with multiple stages and optical heads operating simultaneously, utilizing a conveyor system and robotic sorting, along with a substrate support assembly that uses vacuum pressure and laser beams to outline and separate optical devices without direct contact, enabling high-throughput and deformation-free processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple processing stations are used to process substrates, then processing throughput is improved, but the complexity of the system and handling requirements increase, leading to deformation risks
Solution Approach 1:
The system divides the substrate processing into multiple discrete stages (first stage, second stage, third stage) with dedicated processing stations. Each stage handles specific operations (laser dicing, separation, inspection) independently, allowing parallel processing of multiple substrates while maintaining manageable system complexity through modular architecture
Solution Approach 2:
A substrate support assembly acts as an intermediary carrier that holds substrates during processing. This mediator enables automated handling between stages without direct human contact, reducing deformation risks while coordinating the complex multi-stage process flow
2Reliability
If careful handling is used to prevent device deformation, then device integrity is improved, but processing throughput decreases
Solution Approach 1:
Manual handling operations are replaced with automated robotic systems and laser-based processing. The laser dicing and separation processes eliminate the need for mechanical contact with delicate device structures, maintaining integrity while enabling high-speed automated processing
Solution Approach 2:
The substrate support assembly provides self-aligning and self-retaining features that automatically position and secure substrates during processing. This self-service mechanism eliminates the need for careful manual positioning while ensuring consistent device integrity across high-volume processing
3Manufacturing precision
If substrates are processed sequentially at multiple stations, then processing precision is maintained, but throughput is limited
Solution Approach 1:
Multiple processing functions (laser dicing, separation, inspection) are merged into an integrated system where substrates move through multiple stages simultaneously. The coordinated operation of multiple optical heads and processing stations on different stages enables parallel processing while maintaining precision through synchronized control
4Ease of manufacture
If optical devices are separated from substrates after processing, then device completion is achieved, but deformation risks increase during separation
Solution Approach 1:
Mechanical separation methods that risk device deformation are replaced with laser-based separation processes. The laser beam precisely separates optical devices from substrates through material interaction rather than physical contact, achieving device completion while protecting integrity
Solution Approach 2:
The substrate support assembly serves as an intermediary that maintains device positioning and support during the separation process. This mediator ensures devices remain properly positioned and supported even as separation occurs, preventing deformation while enabling complete device extraction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for simultaneous processing of multiple substrates, reducing deformation risks and enhancing automation, thereby improving throughput and efficiency in manufacturing optical devices with sub-micron features.
Implementation Method 1
The first laser beam is directed toward a first substrate disposed on a first stage for heating and outlining edges of the optical devices on the substrate
Implementation Method 2
The second laser beam is directed toward the first substrate for separating the optical devices from the substrate
Implementation Method 3
A substrate support assembly for retaining a surface of a substrate having one or more optical devices disposed on the surface without contacting the one or more optical devices
Data Source
AI summary
A system for fabricating devices includes a plurality of stages, each stage disposed below a corresponding optical head of a plurality of movable optical heads, each optical head corresponding to a laser source, each optical head comprising a swappable optical head positioned in a staggered position relative to one another such that each laser beam path of each optical head from each corresponding laser source does not intersect one another, a conveyor system coupled to the plurality of stages, and a sorting system comprising a robot capable of moving devices from the conveyor system to at least one backend storage port or to a backend processor.