Dual-Deflection Laser Processing for Multi-Layer Substrate Drilling
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Solution Overview
Problem
Conventional laser processing methods for substrates with multiple layers, such as copper and resin, require lengthy processing times and compromise on quality due to the need for separate trepanning and punching stages with mechanical deflection mechanisms, which are inefficient and lack precise energy adjustment for each layer.
Innovation Solution
A laser processing apparatus employing a combination of AOD and galvano deflection units with controlled RF signals to adjust energy density, allowing for simultaneous trepanning processing of multiple sites with reduced mechanical operations and optimized energy settings for each layer, eliminating the need for separate stages and enhancing processing speed and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate trepanning and punching stages are used with mechanical deflection mechanisms, then processing quality can be maintained, but processing time becomes excessively long
Solution Approach 1:
The patent combines the trepanning and punching operations into a single integrated process. The laser beam is deflected along a spiral trajectory that simultaneously performs both copper layer removal and resin layer processing in one continuous operation, eliminating the need for separate stages and mechanical repositioning.
Solution Approach 2:
The patent replaces mechanical deflection mechanisms with an acousto-optic deflector (AOD) that uses acoustic waves to control laser beam direction. This substitution eliminates mechanical inertia and positioning time, allowing rapid trajectory changes for spiral processing without mechanical intervention between stages.
2Productivity
If mechanical laser deflection mechanisms are used for successive irradiation, then processing can be performed at multiple sites, but the driving operation becomes complex and time-consuming
Solution Approach 1:
The patent replaces complex mechanical deflection systems with an acousto-optic deflector controlled by electronic signals. The AOD uses radio frequency signals to acoustically modulate the laser beam path, simplifying the control system and eliminating mechanical complexity while maintaining multi-site processing capability.
Solution Approach 2:
The patent employs periodic spiral trajectories for laser irradiation at multiple sites. The acousto-optic deflector rapidly modulates the beam position along predetermined spiral paths, allowing systematic processing of multiple locations through periodic repetition of the spiral pattern at different positions.
3Productivity
If energy density is heightened for copper layer processing, then processing efficiency improves, but the resin layer may be damaged
Solution Approach 1:
The patent applies different energy densities at different depths and locations within the processing zone. The spiral trajectory and laser parameters are optimized so that high energy density is concentrated on the copper layer while the resin layer receives controlled energy exposure, preventing damage while maintaining processing efficiency.
Solution Approach 2:
The patent performs preliminary copper layer removal through the spiral trepanning process before the laser energy significantly affects the resin layer. By establishing the processing path and removing the copper barrier first, subsequent resin processing occurs under controlled conditions with reduced risk of damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens processing time and ensures high-quality processing by allowing for precise energy control and reduced mechanical intervention, maintaining the integrity of the copper layer while efficiently processing the resin layer without additional mechanical operations.
Implementation Method 1
a first laser deflection unit (AOD deflection unit 6) configured to deflect the laser pulse emitted from the laser oscillator (4) in a two-dimensional direction
Implementation Method 2
a second laser deflection unit (galvano deflection unit 8) configured to deflect the laser pulse emitted from the first laser deflection unit (AOD deflection unit 6) in a two-dimensional direction
Implementation Method 3
irradiating the laser pulse emitted from the second laser deflection unit (galvano deflection unit 8) onto a substrate (1) to process a plurality of processing positions in the substrate (1)
Data Source
AI summary
A laser processing apparatus includes: a laser oscillator configured to oscillate a laser pulse; a first laser deflection unit configured to deflect the laser pulse emitted from the laser oscillator in a two-dimensional direction; a second laser deflection unit having a slower operation speed and configured to deflect the laser pulse emitted from the first laser deflection unit in a two-dimensional direction on a same plane; a laser oscillation control unit configured to control the laser oscillator; and first and second laser deflection control units respectively configured to control operations of the first and second laser deflection units. The first laser deflection control unit controls the first laser deflection unit to successively irradiate the laser pulse to multiple sites along a predetermined track in each of the processing positions in turn, and to change energy of the laser pulse emitted therefrom in a middle of repeated irradiation.