Composite Carrier for High Power LED Thermal Management
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Solution Overview
Problem
High power LEDs face rapid surface temperature rise and thermal expansion stress due to poor heat dissipation and mismatched thermal expansion coefficients between metallic substrates and insulating materials, leading to reduced light output and reliability.
Innovation Solution
A composite material carrier with a thermal expansion coefficient not greater than 1.2×10−5/°C and thermal conductivity not less than 150 W/m°K, combined with an intermediate layer and connecting means, is used to support and connect electronic components, alleviating thermal stress and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metallic substrate with insulating material is used for high power LED packaging, then electrical insulation is provided, but thermal expansion stress causes chip splitting at the interface
Solution Approach 1:
The patent changes the thermal expansion coefficient parameter of the substrate by using a ceramic substrate (such as Al2O3 or AlN) instead of a metallic substrate. The ceramic substrate has a thermal expansion coefficient (4-8×10^-6/°C) that closely matches the LED chip material, thereby reducing thermal expansion stress and preventing chip splitting while maintaining electrical insulation properties.
Solution Approach 2:
The patent employs composite material structures including ceramic substrates with metal layers (such as Cu or Al) and intermediate layers (such as Ni, Ti, Cr). This composite structure combines the low thermal expansion coefficient of ceramics with the high thermal conductivity of metals, achieving both stress reduction and improved heat dissipation simultaneously.
2Temperature
If conventional metallic substrate packaging is used, then electrical connection is achieved, but heat dissipation is poor causing rapid temperature rise
Solution Approach 1:
The patent changes the thermal conductivity parameter by replacing the metallic substrate with a ceramic substrate having superior thermal conductivity properties. The ceramic substrate efficiently conducts heat away from the chip, preventing rapid temperature rise and associated reliability issues such as epoxy carbonization and chip failure.
3Temperature
If silver paste is used to fasten the chip, then mechanical connection is achieved, but heat transmission is insufficient causing heat crowding
Solution Approach 1:
The patent changes the thermal conductivity parameter of the bonding material by replacing silver paste with a metal layer (such as Cu or Al) having significantly higher thermal conductivity. This enables efficient heat transmission from the chip to the substrate, preventing heat crowding and maintaining photoelectric characteristics and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal stress and enhances heat dissipation, improving the reliability and light output performance of high power LEDs by matching thermal expansion coefficients and providing efficient heat transfer.
Implementation Method 1
The composite material carrier has a thermal conductivity not less than 150 W/m°K... providing efficient heat transfer
Implementation Method 2
The composite material carrier has a thermal expansion coefficient not greater than 1.2×10−5/°C... matching thermal expansion coefficients... alleviating thermal stress
Data Source
AI summary
The present invention relates to an electronic component assembly including a composite material carrier, a circuit carrier made of a dielectric material, a circuit with a conductive material formed on the circuit carrier, an intermediate layer between the circuit carrier and the composite material carrier, and an electronic component arranged on the composite material carrier and electrically connecting to the circuit.