Composite Magnetic Sealing Material for Electronic Circuit Packages
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Solution Overview
Problem
Conventional composite magnetic sealing materials for electronic circuit packages have high thermal expansion coefficients, leading to warping, interfacial delamination, and cracking due to mismatch with semiconductor ICs and substrates, which complicates mounting and connectivity.
Innovation Solution
A composite magnetic sealing material with a resin and filler blend, where the filler contains Fe and Ni-based magnetic materials with a thermal expansion coefficient of 15 ppm/°C or less, and optionally Co and non-magnetic fillers like SiO2, to match the thermal expansion of the substrate and components, ensuring minimal warping and delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional composite magnetic sealing materials are used to achieve magnetic shielding characteristics, then electromagnetic shielding performance is improved, but thermal expansion coefficient increases causing substrate warping and interfacial delamination
Solution Approach 1:
The patent uses a composite magnetic sealing material comprising a resin matrix and magnetic particles (Fe, Ni, Co) with specific composition ratios. This composite structure allows the material to exhibit both magnetic shielding characteristics and controlled thermal expansion properties, resolving the contradiction between electromagnetic shielding performance and manufacturing precision.
Solution Approach 2:
The patent precisely controls the composition parameters of the magnetic sealing material, including the ratios of Fe, Ni, and Co particles, as well as the resin content. By adjusting these parameters, the thermal expansion coefficient is optimized to match the substrate, preventing warping and delamination while maintaining effective magnetic shielding.
2Object-affected harmful factors
If magnetic filler content is increased to improve shielding characteristics, then electromagnetic shielding performance is improved, but thermal expansion coefficient increases causing connectivity problems
Solution Approach 1:
The patent optimizes the magnetic filler content and composition parameters to achieve a balance between shielding performance and thermal expansion control. By carefully selecting the ratios of Fe, Ni, and Co particles along with the resin matrix composition, the material achieves adequate magnetic shielding while maintaining thermal expansion compatibility with the substrate, ensuring connectivity reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal expansion coefficients, preventing substrate warping, interfacial delamination, and cracking while maintaining magnetic shielding characteristics, ensuring reliable electronic circuit package assembly and performance.
Implementation Method 1
a thermal expansion coefficient of 15 ppm/°C or less, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/°C or less
Implementation Method 2
magnetic mold resin covering a front surface of the substrate so as to embed electronic components in the magnetic mold resin. The magnetic mold resin includes a resin material and a filler blended in the resin material
Data Source
AI summary
Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.