Composite Material for Simultaneous Thermal and EMI Shielding
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Solution Overview
Problem
Existing electronic devices have a complex internal structure due to the separate use of heat conducting pads and shielding covers for heat dissipation and electromagnetic shielding, respectively.
Innovation Solution
A composite material comprising an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the conductive layer and insulating layer are attached to the viscose glue layer, allowing the material to be pasted onto electronic components and shielding frames for simultaneous heat dissipation and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat conducting pads and shielding covers are used separately for heat dissipation and electromagnetic shielding, then heat dissipation and electromagnetic shielding functions are achieved, but the internal structure of the electronic device becomes excessively complicated
Solution Approach 1:
The patent combines heat dissipation and electromagnetic shielding functions into a single integrated composite material. This composite material includes a heat conducting layer for heat dissipation, an electromagnetic shielding layer for electromagnetic shielding, and an insulating layer to prevent electrical short circuits. By merging these previously separate components (heat conducting pads and shielding covers) into one composite structure, the patent achieves both heat dissipation and electromagnetic shielding while significantly simplifying the internal structure of the electronic device.
Solution Approach 2:
The composite material is designed to perform multiple functions simultaneously: heat conduction, electromagnetic shielding, and electrical insulation. The heat conducting layer dissipates heat from electronic components, the electromagnetic shielding layer blocks electromagnetic interference, and the insulating layer prevents electrical short circuits. This multi-functional design allows a single component to replace multiple separate components, reducing structural complexity while maintaining comprehensive performance.
2Temperature
If heat conducting material is used to transfer heat from electronic components to housing, then heat dissipation is achieved, but the contact between components and housing may be insufficient leading to high thermal resistance
Solution Approach 1:
The patent employs a composite material structure where the heat conducting layer is specifically designed to improve thermal contact. This layer can be made of materials such as aluminum, copper, or graphite, which have high thermal conductivity. The composite structure allows the heat conducting layer to conform to the surfaces of electronic components and the housing, ensuring intimate contact and reducing thermal resistance. The combination of multiple materials with complementary properties (thermal conductivity, flexibility, adhesion) optimizes heat transfer efficiency while maintaining reliable thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material provides a simpler structure for both heat dissipation and electromagnetic shielding by ensuring firm contact and reducing thermal resistance while maintaining stable electrical connections, thus addressing the complexity of separate components in existing devices.
Implementation Method 1
the viscose glue layer can further fill the gap between the contacting surfaces thereof, thereby reducing thermal resistance and implementing heat dissipation
Implementation Method 2
the electrically and thermally conductive layer can contact the electronic components more firmly... implementing heat dissipation
Implementation Method 3
the viscose glue layer is electrically conductive... a more stable electrical connection can be formed between the electrically and thermally conductive layer and the shielding frames, thereby implementing electromagnetic shielding
Data Source
AI summary
A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.