Composite Semiconductor Inspection With Optical–X-Ray Fusion
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Solution Overview
Problem
Current semiconductor inspection systems lack a comprehensive solution capable of efficiently and precisely measuring diverse complex semiconductor structures, as optical technology is limited by high layer counts and X-ray technology is not integrated effectively across various processes.
Innovation Solution
A composite semiconductor inspection system integrating multi-axis sample stages with both optical and X-ray measurement subsystems, along with a processing device that executes fitting analysis using neural networks, to combine the penetrative capability of X-ray measurement with the speed of optical measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical measurement technology is used for semiconductor inspection, then measurement speed is fast, but measurement precision deteriorates for high layer count structures exceeding 200 layers
Solution Approach 1:
The patent combines optical measurement subsystem and X-ray measurement subsystem into a single composite inspection system. The optical subsystem provides fast measurement speed while the X-ray subsystem provides superior penetration and measurement precision for high layer count structures. By merging both subsystems, the system achieves both high productivity and high measurement precision simultaneously.
Solution Approach 2:
The composite inspection system is designed to handle diverse semiconductor structures across different process technologies universally. The system can inspect both planar and three-dimensional nanoscale structures, as well as high aspect ratio memory structures with over 200 layers, making it applicable to various semiconductor manufacturing processes.
2Measurement precision
If X-ray measurement technology is used to overcome optical limitations, then measurement precision improves for high layer count structures, but device complexity increases
Solution Approach 1:
Instead of replacing optical measurement with X-ray measurement, the patent merges both technologies into a single system. The optical measurement subsystem remains for general inspection tasks while the X-ray measurement subsystem is integrated for penetrating high layer count structures. This merging approach provides enhanced measurement precision without completely redesigning the entire inspection system.
3Device complexity
If a single measurement system is used for diverse semiconductor structures, then device complexity is reduced, but adaptability deteriorates
Solution Approach 1:
The composite inspection system is designed with universal capability to handle diverse semiconductor structures across different process technologies. The system can inspect planar structures, three-dimensional nanoscale structures, and high aspect ratio memory structures with over 200 layers using appropriate measurement modes, making it highly adaptable to various inspection needs.
Solution Approach 2:
The system employs dynamic switching between optical measurement mode and X-ray measurement mode depending on the specific inspection requirements. The multi-axis sample stage can also dynamically adjust positioning and orientation. This dynamic adaptability allows a single system to optimize performance for different semiconductor structures without requiring multiple dedicated devices.
4Adaptability or versatility
If multiple separate measurement systems are used for different semiconductor processes, then adaptability is high, but device complexity and loss of time increase
Solution Approach 1:
The patent merges optical measurement and X-ray measurement capabilities into a single composite inspection system with a shared multi-axis sample stage and processing device. This integration eliminates the need to switch between separate measurement systems, reducing time loss while maintaining the adaptability to handle diverse semiconductor structures through coordinated operation of both measurement subsystems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and efficient analysis of complex semiconductor components by merging X-ray and optical technologies, providing accurate structural parameters through integrated machine learning, enhancing measurement efficiency and throughput.
Implementation Method 1
The light source generator is configured to generate a measurement light beam with a wavelength in the optical wavelength range
Implementation Method 2
The X-ray generator generates a measurement X-ray beam
Data Source
AI summary
A composite semiconductor inspection system is provided, which includes a multi-axis sample stage, an optical measurement subsystem, an X-ray measurement subsystem and a processing device. The optical measurement subsystem includes a light source generator, an incident-end optical element group, a receiving-end optical element group and an optical receiver. The optical receiver is used to receive an optical signal to-be-measured and generate corresponding optical spectrum information. The X-ray measurement subsystem includes an X-ray generator, an X-ray optical element group and an X-ray detector. The X-ray detector is used to receive an X-ray signal to-be-measured and generate corresponding X-ray spectrum information. The processing device is configured to execute a fitting analysis program based on the optical spectrum information and the X-ray spectrum information to obtain structural parameters of a sample to-be-tested as analysis results.