Composite Polishing Layer Forming Method for CMP Pad
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Solution Overview
Problem
Conventional chemical mechanical polishing pads face challenges in expanding their operating performance range as wafer dimensions shrink, requiring new polishing layer designs that decouple polishing layer stiffness and slurry distribution performance.
Innovation Solution
A method for forming a chemical mechanical polishing pad composite polishing layer using an axial mixing device, where a first polishing layer component with periodic recesses is filled with a combination of poly side and iso side liquid components and pressurized gas, forming a second non-fugitive polymeric phase that solidifies within the recesses, creating a composite structure with enhanced polishing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional polishing layer designs are used, then manufacturing simplicity is maintained, but polishing performance range is limited
Solution Approach 1:
The polishing layer is segmented into multiple discrete components including a porous support layer, a polymeric layer with periodic recesses, and a composite polishing layer. This segmentation allows each layer to be optimized independently for specific functions while maintaining overall manufacturing feasibility through modular construction.
Solution Approach 2:
The invention employs composite materials by combining a polymeric phase with a inorganic filler phase within the composite polishing layer. This composite structure enables simultaneous achievement of enhanced polishing performance and controlled mechanical properties without requiring complete redesign of the entire polishing layer system.
2Adaptability or versatility
If groove stiffness and fluid flow are optimized separately, then manufacturing simplicity is maintained, but polishing performance balance is limited
Solution Approach 1:
The periodic recesses are strategically positioned and dimensioned to create local variations in stiffness and fluid flow characteristics. By controlling the depth, width, and spacing of individual recesses, the design achieves localized optimization of mechanical properties and slurry distribution without requiring complex overall structural changes.
Solution Approach 2:
The invention utilizes parameter changes by systematically varying the depth, width, pitch, and cross-sectional shape of the periodic recesses. These parameter adjustments enable independent tuning of groove stiffness quotient and groove flow quotient to achieve optimal polishing performance balance for specific application requirements.
3Adaptability or versatility
If single-phase polishing layers are used, then manufacturing simplicity is maintained, but polishing performance properties are limited
Solution Approach 1:
The composite polishing layer combines organic polymeric phases with inorganic filler phases, enabling simultaneous achievement of enhanced polishing performance properties and controlled mechanical characteristics. This composite approach expands the available performance property range without requiring complete system redesign.
Solution Approach 2:
The polishing layer is divided into functionally distinct phases including continuous polymeric matrix and dispersed inorganic filler particles. This phase segmentation allows each component to contribute specific performance properties while maintaining manufacturing feasibility through established composite material processing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method breaks the mold of established Groove Stiffness Quotient and Groove Flow Quotient parameters, expanding the range of polishing performance properties and achieving unobtainable balances of polishing performance, resulting in improved planarization and substrate polishing capabilities.
Implementation Method 1
wherein the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas are intermixed within the internal cylindrical chamber to form a combination
Implementation Method 2
wherein an inlet velocity into the internal cylindrical chamber of the pressurized gas is 90 to 600 m/s; discharging the combination from the open end of the internal cylindrical chamber toward the polishing side of the first polishing layer component at a velocity of 10 to 300 msec
Implementation Method 3
providing a poly side (P) liquid component, comprising at least one of a (P) side polyol, a (P) side polyamine and a (P) side alcohol amine; providing an iso side (I) liquid component, comprising at least one polyfunctional isocyanate
Implementation Method 4
allowing the combination to solidify as a second polishing layer component in the plurality of periodic recesses to form a composite structure
Data Source
AI summary
A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 10 to 300 msec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.