Composite Seed Structure Enhances PMA in pSTT-MRAM

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Solution Overview

Problem

Conventional magnetic pinning structures in perpendicular magnetic tunnel junctions face challenges in achieving stable magnetic pinning due to limitations in perpendicular magnetic anisotropy (PMA), which affects device miniaturization, current efficiency, and thermal stability.

Innovation Solution

A composite seed structure (CSS) with a face-center-cubic (FCC) crystalline structure is introduced, comprising a modulating-layer, buffer-layer, and top-seed-layer, along with an alloy anti-ferromagnetic coupling spacer, to enhance perpendicular magnetic anisotropy and stabilize the magnetic pinning layer, promoting FCC (111) growth and anti-ferromagnetic coupling for improved PMA.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional magnetic pinning structures are used, then device structure is simple, but perpendicular magnetic anisotropy is insufficient leading to poor magnetic pinning stability

Engineering Contradiction:
Improvemagnetic pinning stabilityVSAvoidseed structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies composite materials by creating a multi-layer seed structure comprising a first seed layer (e.g., Ru), a second seed layer (e.g., Rh), and a third seed layer (e.g., Ir), where each layer contributes different properties to achieve enhanced perpendicular magnetic anisotropy and stable magnetic pinning that cannot be achieved with single-material seed layers

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The seed structure is segmented into multiple functional layers with distinct thicknesses and materials (first seed layer 1-5 nm, second seed layer 1-3 nm, third seed layer 0.5-2 nm), where each segment performs a specific function in promoting FCC crystal structure and enhancing PMA

Inventive Principle:
Principle #1Segmentation

2Volume of moving object

If device miniaturization is pursued, then device size is reduced, but current efficiency decreases due to insufficient PMA

Engineering Contradiction:
Improvedevice sizeVSAvoidcurrent efficiency
Core Design Contradiction:
Volume of moving objectVSUse of energy by moving object

Solution Approach 1:

The patent changes material parameters by selecting specific materials (Ru, Rh, Ir) and optimizing their thickness parameters (1-5 nm, 1-3 nm, 0.5-2 nm respectively) to maximize perpendicular magnetic anisotropy, enabling miniaturized devices to maintain high current efficiency through enhanced magnetic pinning stability

Inventive Principle:
Principle #35Parameter changes

3Temperature

If PMA is enhanced for better pinning, then thermal stability improves, but device complexity increases

Engineering Contradiction:
Improvethermal stabilityVSAvoidseed layer structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies local quality by concentrating the complexity only in the seed layer region (first, second, and third seed layers with specific materials and thicknesses) while keeping the rest of the magnetic tunnel junction structure simple, thereby achieving enhanced thermal stability through localized structural optimization

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The CSS enhances perpendicular magnetic anisotropy, stabilizes magnetic pinning, and maintains high tunnel magneto-resistance (TMR) values, enabling device miniaturization, reduced current requirements, and improved thermal stability in magnetic memory applications.

Implementation Method 1

The CSS enhances perpendicular magnetic anisotropy, stabilizes magnetic pinning, and maintains high tunnel magneto-resistance (TMR) values, enabling device miniaturization

Methodology Applied
Scientific EffectCrystallisation: Crystallisation

Implementation Method 2

A composite seed structure (CSS) with a face-center-cubic (FCC) crystalline structure is introduced, comprising a modulating-layer, buffer-layer, and top-seed-layer

Methodology Applied
Scientific EffectLattice matching:

Implementation Method 3

along with an alloy anti-ferromagnetic coupling spacer, to enhance perpendicular magnetic anisotropy and stabilize the magnetic pinning layer, promoting FCC (111) growth and anti-ferromagnetic coupling for improved PMA

Methodology Applied
Scientific EffectAnti-ferromagnetic coupling: Magnetism

Implementation Method 4

The magnetic state of an MRAM cell is read out by using the tunnel magneto-resistance (TMR) of the MTJ

Methodology Applied
Scientific EffectTunnel magneto-resistance: Magnetoresistance

Implementation Method 5

the magnetization direction of a free layer (FL) is reversed by applying a spin-polarized current to the magnetoresistive element

Methodology Applied
Scientific EffectSpin transfer torque:

Implementation Method 6

using spin momentum transfers

Methodology Applied
Scientific EffectSpin momentum transfer:

Data Source

PatentUS11450466B2Composite seed structure to improve PMA for perpendicular magnetic pinning
Publication Date: 2022.09.20 GUO YIMIN
  • US11450466B2 patent drawing
  • US11450466B2 patent drawing
  • US11450466B2 patent drawing

AI summary

The invention comprises a novel composite seed structure (CSS) having lattice constant matched crystalline structure with the Co layer in above perpendicular magnetic pinning layer (pMPL) so that an excellent epitaxial growth of magnetic super lattice pinning layer [Co/(Pt, Pd or Ni)]n along its FCC (111) orientation can be achieved, resulting in a significant enhancement of perpendicular magnetic anisotropy (PMA) for perpendicular spin-transfer-torque magnetic-random-access memory (pSTT-MRAM) using perpendicular magnetoresistive elements as basic memory cells which potentially replace the conventional semiconductor memory used in electronic chips, especially mobile chips for power saving and non-volatility.