Composite Semiconductor Component With Projecting Elements
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Solution Overview
Problem
During the production of complex semiconductor components, forming reliable electrical connections between semiconductor chips and carrier substrates of different materials is challenging, especially when the chips are transferred and need to be mechanically linked.
Innovation Solution
A composite semiconductor component is created with a carrier substrate and a semiconductor chip, where projecting elements made of electrically conductive material are formed on the substrate and connected to contact pads on the chip, allowing for a secure mechanical and electrical bond using an adhesive, with the contact pads having a larger lateral extent than the projecting elements for enhanced contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a mechanical linking of the semiconductor chip to the carrier substrate is performed during transfer, then the mechanical stability is improved, but forming reliable electrical connections becomes challenging
Solution Approach 1:
The electrical connection structure is segmented into multiple components: a projecting element extending from the carrier substrate, an adhesive layer for mechanical bonding, and a contact pad on the semiconductor chip. This segmentation allows each component to fulfill its specific function - the projecting element provides electrical conductivity, the adhesive provides mechanical stability, and the contact pad ensures electrical contact, thereby resolving the contradiction between mechanical stability and electrical connection reliability.
Solution Approach 2:
The projecting element acts as an intermediary structure between the carrier substrate and the semiconductor chip. It extends from the carrier substrate toward the chip, providing both mechanical support and electrical conductivity. The adhesive layer applied to the projecting element serves as a mediator that enables both mechanical bonding and maintains electrical connection pathways, thus resolving the contradiction between mechanical stability and electrical connection reliability.
2Ease of manufacture
If the contact pad and projecting element have equal lateral extent, then the manufacturing is simplified, but the electrical connection reliability is reduced
Solution Approach 1:
The contact pad is designed with a larger lateral extent than the projecting element, creating a localized quality difference. This ensures that the contact pad fully covers the projecting element's contact area, providing redundant electrical contact pathways and improving connection reliability. The asymmetry in lateral extent is deliberately introduced at the critical contact interface to enhance reliability without significantly complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures reliable electrical connections and improved mechanical stability of the semiconductor components, facilitating the transfer and integration of semiconductor chips onto carrier substrates while allowing for efficient heat dissipation and flexibility in chip size and terminal arrangement.
Implementation Method 1
an adhesive that is arranged between the semiconductor chip and the carrier substrate and is suitable for mechanically connecting the semiconductor chip and the carrier substrate
Implementation Method 2
an element projecting from a first main surface of the carrier substrate and comprising an electrically conductive material, which is electrically conductively connected to a contact region of the carrier substrate
Data Source
AI summary
In an embodiment a composite semiconductor component includes a carrier substrate having a plurality of projecting elements projecting from a first main surface of the carrier substrate, an electrically conductive material electrically conductively connected to a contact region of the carrier substrate and located on at least one of the projecting elements, some of the projecting elements not being covered with the electrically conductive material and a semiconductor chip arranged on the carrier substrate and having at a first surface at least one contact pad electrically connected to the electrically conductive material on at least one element, wherein, at a position at which the contact pad and the electrically conductive material on the projecting element are in each case in contact with one another, the contact pad has a larger lateral extent than the projecting element in each case.