Composite Spring Heat Spreader for Multi-Rail Cooling Modules

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Solution Overview

Problem

Conventional thermal interface materials, such as thermal grease, offer minimal thermal performance and poor elasticity, leading to inadequate heat transfer and potential damage from over-compression in electrical components, while gap pads provide high elasticity but low thermal conductivity, resulting in thermal gradients and assembly tolerance issues.

Innovation Solution

A composite spring heat spreader integrating a high-strain composite spring material with a thin, highly thermally conductive material, providing mechanical pressure and efficient heat transfer while accommodating assembly tolerances through flexible flexure regions and tailored laminate architecture.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional thermal grease is used as thermal interface material, then thermal conductivity is improved, but mechanical compliance and elasticity deteriorate

Engineering Contradiction:
Improvethermal conductivityVSAvoidmechanical compliance
Core Design Contradiction:
TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent uses composite spring material comprising interconnected spring strands formed from metal alloy or polymer matrix with embedded spring elements. This composite structure combines the high thermal conductivity of metal materials with the mechanical compliance and elasticity of spring elements, resolving the contradiction between thermal performance and mechanical adaptability.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the physical state and mechanical properties of the thermal interface material by incorporating spring elements that can dynamically adjust their compression state. The material transitions from a static, rigid thermal grease to a dynamic, compliant spring structure that maintains optimal contact pressure while conducting heat efficiently.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If gap pads are used as thermal interface material, then mechanical compliance and elasticity are improved, but thermal conductivity deteriorates

Engineering Contradiction:
Improvemechanical complianceVSAvoidthermal conductivity
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent replaces conventional gap pad materials with composite spring material that integrates metal spring elements within a metal or polymer matrix. This composite structure maintains the mechanical compliance needed to accommodate assembly tolerances while providing significantly improved thermal conductivity through the metal components.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent substitutes the purely mechanical compression mechanism of gap pads with a hybrid system combining mechanical spring elements and thermal conduction pathways. The spring strands provide both the mechanical compliance function and the thermal conduction function simultaneously, eliminating the need for separate materials.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If compliant materials are used to absorb assembly tolerances, then mechanical compliance is improved, but thermal transfer efficiency deteriorates

Engineering Contradiction:
Improvemechanical complianceVSAvoidthermal transfer efficiency
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent employs composite spring material where metal spring strands embedded in a metal or polymer matrix simultaneously provide mechanical compliance to absorb assembly tolerances and maintain thermal transfer efficiency. The metal components ensure adequate thermal conduction while the spring structure provides the necessary compliance.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The composite spring material performs multiple functions simultaneously: it provides mechanical compliance to accommodate tolerance variations, maintains consistent contact pressure on heat generating components, and conducts heat efficiently to the heat sink. This multi-functionality eliminates the need to trade off between compliance and thermal performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Temperature

If high compression force is applied to maintain thermal contact, then thermal transfer is improved, but component damage from over-compression occurs

Engineering Contradiction:
Improvethermal transferVSAvoidcomponent damage
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent uses dynamic spring elements that can automatically adjust their compression force based on the contact conditions and thermal expansion. The spring strands exert distributed, adaptive pressure that maintains thermal contact without exceeding damage thresholds, replacing static high compression forces with dynamic, self-regulating pressure.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the compression parameter from a fixed, high force to a variable, distributed force delivered by spring elements. The spring material modulates the compression parameter to maintain optimal contact pressure that ensures thermal transfer while preventing over-compression damage to sensitive components.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composite spring heat spreader achieves high thermal conductivity and mechanical compliance, maintaining consistent contact between heat generating components and heat sinks during shock and vibration, while minimizing thermal gradients and avoiding component damage.

Implementation Method 1

The cooling module is formed to contact the heat generating component... achieving high thermal conductivity and mechanical compliance, maintaining consistent contact between heat generating components and heat sinks

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

integrating a high-strain composite spring material with a thin, highly thermally conductive material, providing mechanical pressure and efficient heat transfer while accommodating assembly tolerances through flexible flexure regions

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS12052847B2Aligned multi-rail high-power cooling module
Publication Date: 2024.07.30 RAYTHEON CO
  • US12052847B2 patent drawing
  • US12052847B2 patent drawing
  • US12052847B2 patent drawing

AI summary

A system includes a pair of chassis, a housing, and a cooling module. Each chassis including multiple rails with adjacent rails defining card slots. The housing connected to the chassis in first card slots on the pair of chassis and formed to contain electronic components including a heat generating component. The cooling module connected to the chassis in second card slots on the pair of chassis and formed to contact the heat generating component through an aperture in the housing.