Flexible Compound-Eye Imaging Layout With Shared Pixel Signal Leads

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Solution Overview

Problem

Traditional electronic imaging devices with planar structures require complex multi-layered lenses to focus light, resulting in bulky and heavy cameras, and their circuit complexity is increased by independent signal leads for each pixel, which complicates the overall structure.

Innovation Solution

An electronic imaging device with a flexible base substrate and an array of photosensitive units, each comprising a photodiode and a rectifier diode connected in series, sharing a common doped region, and interleaved signal leads to simplify the structure and reduce thickness, along with a flexible lens structure for adaptive imaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a planar structure with CMOS or CCD photosensitive devices is used, then light can be converged on a plane to form an image, but a multi-layered complex lens is required which increases device thickness and weight

Engineering Contradiction:

Improveimage formation capabilityVSAvoiddevice thickness

Core Design Contradiction:

Measurement precisionVSLength of stationary object

Solution Approach 1:

The patent divides the photosensitive surface into multiple layers with photosensitive units at different depths, each layer capturing light from different angles and depths. This segmentation eliminates the need for complex multi-layered lenses while maintaining image formation capability, directly reducing device thickness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from a traditional planar 2D photosensitive structure to a three-dimensional stacked structure with photosensitive units positioned at different depths along the optical axis. This dimensional change allows light convergence without requiring thick lens systems, thereby reducing overall device thickness.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If independent signal leads are provided for each pixel, then signal transmission is ensured, but circuit complexity and overall structure complexity increase

Engineering Contradiction:

Improvesignal transmissionVSAvoidcircuit complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the signal leads of multiple photosensitive units by connecting series-connected photosensitive units to common signal lines. This consolidation reduces the total number of signal leads required while maintaining reliable signal transmission from all pixels, thereby simplifying the circuit structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Each signal lead serves multiple functions by collecting signals from multiple photosensitive units within its group. This multi-functionality approach reduces the overall number of leads needed in the system, simplifying both the circuit design and physical structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If a flexible base substrate is used with arrayed photosensitive units, then device flexibility and adaptability to different surfaces are improved, but manufacturing complexity may increase

Engineering Contradiction:

Improveadaptability to different surfacesVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent employs a flexible base substrate that allows the entire photosensitive array to be bent or conform to different surface geometries. This flexibility is achieved through careful material selection and structural design that maintains electrical connections while enabling form adaptation, without significantly complicating the manufacturing process.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces camera thickness by 30-50%, simplifies the circuit, and enables stereoscopic imaging within a certain range by sharing signal leads and using a flexible base substrate for adaptive fit on different surfaces, while maintaining image quality and reducing wiring complexity.

Implementation Method 1

each of the photosensitive units comprises a photodiode and a rectifier diode connected in series, wherein the photodiode comprises a first conduction type doped region and a second conduction type doped region

Methodology Applied

Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS11791364B2Electronic compound eye imaging device

Publication Date: 2023.10.17 BOE TECHNOLOGY GROUP CO LTD

AI summary

The disclosure provides an electronic imaging device and a manufacturing method thereof, a flexible electronic compound eye and a manufacturing method thereof. The electronic imaging device includes a base substrate and a plurality of photosensitive units arranged in an array on a surface of the base substrate, at least one of the photosensitive units includes a photodiode and a rectifier diode connected in series. The photodiode includes a first conduction type doped region and a second conduction type doped region, the rectifier diode includes a first conduction type doped region and a second conduction type doped region, and the first conduction type doped region of the photodiode and the first conduction type doped region of the rectifier diode are electrically connected to each other.