Compression Molding Thermal Control for Semiconductor Chip Panels
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Solution Overview
Problem
The challenge in semiconductor chip packaging is to balance the temperature during compression molding to accelerate curing while maintaining stable adhesion of semiconductor chips to the carrier, as high temperatures can cause the adhesive properties to deteriorate, leading to 'flying dies' during the packaging process.
Innovation Solution
Implementing a method where the temperature at the upper surface of the carrier is kept low during the compression phase and increased during the curing phase, using techniques such as creating a gap between the tools, employing a carrier with low heat conductivity layers, or using a heat flow delay element to control heat transfer, ensuring the adhesive properties remain intact and the chips are securely attached.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high temperature is applied during compression molding to accelerate curing, then curing speed is improved, but adhesive properties deteriorate causing chips to peel from the carrier
Solution Approach 1:
The patent applies dynamic temperature control where the temperature of the first tool is varied during the compression molding process. Initially, a lower temperature is used to maintain adhesive properties, then temperature is increased to accelerate curing. This dynamic adjustment resolves the contradiction between maintaining adhesion and achieving fast curing.
Solution Approach 2:
The patent applies preliminary heating to the second tool while keeping the first tool at a lower temperature during the initial compression phase. This preliminary action allows the mold material to begin curing without exposing the adhesive interface to high temperatures that would cause deterioration. The first tool temperature is then increased in a subsequent phase to complete the curing process.
2Productivity
If temperature is increased to accelerate curing of mold material, then manufacturing efficiency is improved, but risk of flying dies increases
Solution Approach 1:
The patent uses dynamic temperature control where the first tool temperature is initially kept low to prevent adhesive deterioration and flying dies, then increased later to accelerate curing and improve manufacturing efficiency. This temporal separation of temperature levels eliminates the harmful effect while achieving the productivity benefit.
Solution Approach 2:
The patent segments the compression molding process into distinct temperature phases: an initial low-temperature phase for compression and adhesion maintenance, followed by a high-temperature phase for accelerated curing. This segmentation allows each phase to optimize for its specific objective without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable encapsulation of semiconductor chips with reduced risk of peeling, achieving stable and efficient packaging by maintaining adhesive integrity and optimizing curing conditions.
Implementation Method 1
employing a carrier with low heat conductivity layers, or using a heat flow delay element to control heat transfer
Implementation Method 2
a heat transfer from the first tool to an upper surface of the carrier is delayed
Data Source
AI summary
The method includes providing a plurality of semiconductor chips and placing the plurality of semiconductor chips on a carrier. A compression molding apparatus is provided that includes a first tool and a second tool. The carrier is placed on the first tool of the compression molding apparatus and the semiconductor chips are encapsulated in a mold material by compression molding. During compression molding a heat transfer from the first tool to an upper surface of the carrier is delayed.