Compressive Film on Substrate Bevel for Particle Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor and LCD manufacturing, micro particle generation at substrate edges during mechanical clamping is a significant issue, leading to electrical damage and yield reduction, as existing methods like vacuum chucks are inadequate for modern high-integration manufacturing and slow substrate transfer speeds compromise productivity.
Innovation Solution
A method involving the deposition of a compressive film with high mechanical strength only on the substrate's bevel portion, using plasma-enhanced chemical vapor deposition, to cancel mechanical stress and prevent particle generation during clamping and transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a vacuum chuck is used to clamp the substrate, then particle generation at the edge is reduced, but particles are generated on the backside surface affecting lithography accuracy
Solution Approach 1:
The invention applies a compressive stress film only to the bevel portion (edge region) of the substrate, leaving the central processing area unaffected. This localized treatment prevents edge particles during mechanical clamping while avoiding backside particle generation that would interfere with lithography focal point accuracy.
2Object-affected harmful factors
If substrate transfer speed is reduced to prevent particle generation, then particle generation is reduced, but productivity decreases
Solution Approach 1:
The compressive stress film is deposited on the bevel portion before substrate transfer operations. This preliminary protective action prevents particle generation during subsequent mechanical clamping and transfer processes, allowing substrate transfer to proceed at normal high speeds without productivity loss.
3Area of stationary object
If a tensile film is deposited on the substrate surface, then film coverage is improved, but particle generation increases due to film peeling during clamping
Solution Approach 1:
The compressive stress film deposited on the bevel portion acts as a counterbalancing force to the tensile stress in films deposited on the substrate surface. This stress compensation prevents film peeling during mechanical clamping, thereby preventing particle generation while maintaining full film coverage on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively inhibits particle generation during substrate transfer by stabilizing the bevel portion, reducing electrical damage and maintaining high productivity without the limitations of vacuum chucks or slow transfer speeds.
Implementation Method 1
depositing a film having high mechanical strength by generating a plasma only over the substrate edge area
Implementation Method 2
generating a plasma only over the substrate edge area (bevel portion)
Data Source
AI summary
A method for transporting a substrate using an end effector which mechanically clamps a periphery of the substrate includes: before transporting the substrate, depositing a compressive film only on, at, or in a bevel portion of the substrate; and transporting the substrate whose bevel portion is covered by the compressive film as the outermost film, using an end effector while mechanically clamping the periphery of the substrate.