Concave Molded Section for Semiconductor Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor device manufacturing methods fail to effectively reduce thermal noise and thickness while maintaining heat radiation efficiency, leading to image quality degradation in miniaturized devices like smartphones and tablets.

Innovation Solution

A semiconductor device with a molded section of high heat conductivity resin forming a concave shape around an integrated circuit and chip parts on an organic substrate, where the solid-state image pickup element is positioned lower than the peripheral portion, allowing heat transfer from the central to the peripheral portion, and optionally including a glass section, air holes, or heat radiation fins for enhanced cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the external dimensions and thickness of the resin sealing are decreased to miniaturize the device, then the device size is reduced, but heat radiation efficiency deteriorates leading to temperature elevation of the solid-state image pickup element

Engineering Contradiction:

Improvedevice sizeVSAvoidtemperature of solid-state image pickup element

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The resin sealing is divided into a flat section and an inclined section, creating distinct functional zones. The flat section provides a large surface area for heat radiation, while the inclined section directs heat away from the solid-state image pickup element, enabling effective heat dissipation in a miniaturized device.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The resin sealing surface is designed with an inclined section that slopes downward from the flat section toward the peripheral portion. This three-dimensional configuration allows heat to be radiated more effectively by utilizing the inclined surface area, improving heat radiation efficiency without increasing the overall device footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Use of energy by moving object

If heat is transferred from the IC to the solid-state image pickup element to improve thermal coupling, then heat radiation efficiency improves, but thermal noise increases degrading image quality

Engineering Contradiction:

Improveheat radiation efficiencyVSAvoidthermal noise

Core Design Contradiction:

Use of energy by moving objectVSObject-affected harmful factors

Solution Approach 1:

Different sections of the resin sealing are assigned different functions: the flat section close to the IC serves as a heat reception area with high thermal coupling, while the inclined section farther from the IC serves as a heat radiation area. This spatial differentiation of thermal properties allows efficient heat transfer from the IC while directing the heat away from the solid-state image pickup element to minimize thermal noise.

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If a spacer is bonded to the IC top surface to suppress heat transfer, then thermal noise is reduced, but manufacturing complexity increases due to additional steps

Engineering Contradiction:

Improvethermal noiseVSAvoidmanufacturing steps

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The resin sealing serves multiple functions simultaneously: it seals the device, provides structural support, and acts as a thermal management component. The flat section receives heat from the IC while the inclined section radiates heat away, eliminating the need for separate spacers or thermal insulation layers and simplifying the manufacturing process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses thermal noise and reduces device thickness, improving heat radiation efficiency and maintaining image quality by efficiently transferring heat away from the solid-state image pickup element.

Implementation Method 1

the central portion of the molded section and the peripheral portion are connected to each other, so that heat generated from the integrated circuit can be transferred from the central portion of the molded section to the peripheral portion

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

increasing heat radiation efficiency to suppress temperature elevation of an arranged solid-state image pickup element

Methodology Applied

Scientific EffectHeat radiation: Thermal Radiation

Data Source

PatentUS10388683B2Semiconductor device and method of manufacturing semiconductor device

Publication Date: 2019.08.20 SONY GROUP CORP

AI summary

A semiconductor device includes an organic substrate, an integrated circuit, a chip part, a molded section and a solid-state image pickup element. The integrated circuit and the chip part are on the organic substrate. The molded section, including a central portion and a peripheral portion, form a concave shape. The central portion seals the integrated circuit and the chip part. The peripheral portion is around the central portion. The solid-state image pickup element is on the central portion of the molded section. The solid-state image pickup element has a top edge that is lower in position in a thickness direction than a top edge of the peripheral portion of the molded section.