Memory Data Paths Using Concurrent PAM and NRZ Modulation
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Solution Overview
Problem
Current memory devices face limitations in increasing memory cell density, read/write speeds, data retention, power consumption, and manufacturing costs, particularly in efficiently transferring data across multiple channels using different signaling techniques.
Innovation Solution
Implementing a memory system that supports multiple concurrent modulation schemes, where a memory controller communicates signals modulated using different schemes through separate signal paths, such as a first signal path with at least three levels and a second signal path with at least two levels, to improve read and write speeds and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multiple modulation schemes are implemented concurrently through separate signal paths, then read and write speeds are improved, but device complexity increases
Solution Approach 1:
The patent divides the signal transmission system into multiple separate signal paths, each dedicated to a specific modulation scheme (e.g., PAM3 path and PAM2 path). This segmentation allows concurrent operation of different modulation schemes without interference, improving overall data transfer speed while managing complexity through functional separation
Solution Approach 2:
The patent extends the signal transmission system by adding multiple signal paths as an additional dimension. Instead of using a single path that must handle all modulation schemes sequentially, the system creates parallel transmission channels, effectively moving from a one-dimensional to a multi-dimensional transmission architecture
2Reliability
If multiple modulation schemes are implemented concurrently through separate signal paths, then performance and reliability are improved, but manufacturing costs increase
Solution Approach 1:
By segmenting the transmission system into dedicated paths for different modulation schemes, the patent enables optimized manufacturing for each path. Each signal path can be designed and manufactured independently with specific characteristics tailored to its modulation scheme, potentially reducing overall manufacturing complexity despite the multi-path architecture
Solution Approach 2:
The patent creates a universal memory interface that can handle multiple modulation schemes simultaneously through separate paths. This multi-functional design allows the system to adapt to different data transfer requirements while maintaining a standardized interface architecture, which can simplify manufacturing processes across different product variants
3Use of energy by moving object
If multiple modulation schemes are implemented concurrently through separate signal paths, then power consumption is reduced, but device complexity increases
Solution Approach 1:
The patent implements dynamic modulation scheme selection where the system can adaptively choose between different modulation schemes (PAM3, PAM2, etc.) based on current operational requirements. This dynamic approach allows the system to optimize power consumption by selecting lower-order modulation schemes when high speed is not required, while still maintaining the capability for high-speed operation when needed
Solution Approach 2:
The patent changes the modulation parameters (number of levels, signal amplitude) to optimize power consumption. By using separate signal paths with different modulation parameters, the system can transmit data more efficiently with lower power requirements for each path, reducing overall power consumption while maintaining high data transfer capabilities
Data Source
AI summary
Methods, systems, and devices for multiple concurrent modulation schemes in a memory system are described. Techniques are provided herein to communicate data using a modulation scheme having at least three levels and using a modulation scheme having at least two levels within a common system or memory device. Such communication with multiple modulation schemes may be concurrent. The modulated data may be communicated to a memory die through distinct signal paths that may correspond to a particular modulation scheme. An example of a modulation scheme having at least three levels may be pulse amplitude modulation (PAM) and an example of a modulation scheme having at least two levels may be non-return-to-zero (NRZ).