Antiferromagnetically coupled magnetic layers and a spacer improve domain motion and tunnel magnetoresistance while lowering write current.
A recessed magnetic shield layer between MTJ storage patterns blocks external field interference while avoiding extra patterning steps.
Oxygen vacancies and a low-carrier metal oxide electrode help control conductive protrusions, improving on-off ratio and storage reliability.
Vertical transistor active layers enable stacked memory layers that raise DRAM density without the cost and difficulty of extreme transistor scaling.
Low-k oxide and nitride spacers around the MTJ cut capacitance between adjacent MRAM cells, reducing RC delay for high-frequency operation.
An opposite-side magnetic layer uses spin-orbit torque to switch free-layer magnetization at lower critical current and power.
Sidewall spin-orbit torque assists spin-transfer switching in magnetic tunnel junctions, cutting write current and breakdown risk.
Alternating Co-E layers and an insertion layer tune Heusler PMA, lowering coercivity and anisotropy for STT switching in thicker MRAM cells.
A shared low-resistivity SHE rail links stacked vertical MRAM cells to raise density while limiting write-line resistance and back sputtering.
An amorphous CoFeBX buffer and W, Mo, or Ta auxiliary layer block diffusion and crystalline collisions to preserve TMR and exchange field.
Multiple MTJs in series with a source resistor and comparator broaden p-bit stochastic range and enable smoother probability tuning.
A decoupled stochastic and control path uses sMTJ voltage-divider p-bits to improve tunability, reduce errors, and scale probabilistic computing.
A chiral PSM layer beside the MTJ free layer adds spin-transfer torque, lowering switching current without thickening the stack.
A simplified SAF fixed-layer stack cancels stray magnetic fields, improves data retention, and reduces surface roughness in MRAM cells.
Different N/Ti ratios and spacer thicknesses tune MTJ TMR across MRAM array regions to improve speed, retention, power use, and cost.
Interleaving commands across memory bank groups cuts idle access gaps and raises dynamic memory throughput for real-time ADAS and AV workloads.
A dual magnetic tunnel junction stack uses a shoulder electrode for independent SOT and STT switching, enabling two-bit storage with lower power dissipation.
Metal interconnect protrusions contacting MTJ-side liners improve alignment, cut chip area and power use, and reduce temperature sensitivity.
Dummy fins selectively narrow PG fins while keeping PD fins wider, improving SRAM beta ratio and static noise margin.
Recording the peak dV/dt at an electrode enables on-chip life and degradation prediction with less added monitoring complexity.
A Re/Ru multilayer seed layer helps magnetic tunnel junctions preserve pinned-layer crystal quality, RA, and TMR after heat treatment.
A rhenium or Re/Ru seed layer helps magnetic tunnel junctions preserve TMR and magnetic properties after high-temperature annealing.
Narrow and interdigitated active areas isolate 3D NAND erase voltages from low-voltage circuits while cutting leakage and layout area.