Stacked Chip Oscillator Calibration for Speed Synchronization

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Solution Overview

Problem

In semiconductor apparatuses with stacked chips, variations in operation environments such as voltage and temperature lead to differing operating speeds among chips, affecting performance and current consumption.

Innovation Solution

A semiconductor apparatus that includes chips electrically connected through electrodes, where one chip generates an oscillator signal and compares it with a reference signal to adjust impedance and timing, enabling synchronized operation speeds across stacked chips.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If stacked chips are used to increase integration, then productivity is improved, but operating speeds of stacked chips differ due to voltage and temperature variations

Engineering Contradiction:
ImproveintegrationVSAvoidoperating speed consistency
Core Design Contradiction:
ProductivityVSSpeed

Solution Approach 1:

The patent adjusts operating parameters (voltage levels, timing configurations) of individual chips based on their specific environmental conditions. Each chip's parameters are dynamically modified to compensate for temperature and voltage variations, ensuring synchronized operation across the stacked structure while maintaining high integration.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If chips operate at different speeds due to environmental variations, then adaptability to different conditions is improved, but operation performance deteriorates

Engineering Contradiction:
Improveenvironmental adaptationVSAvoidoperation performance
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The system implements feedback mechanisms where each chip monitors its own operating conditions (temperature, voltage) and communicates with control logic to adjust its operation. This closed-loop control allows chips to adapt to their specific environmental conditions while maintaining synchronized performance across the entire stacked system.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

Each chip in the stacked structure is configured with local adjustments specific to its operating environment. Different chips can have different voltage levels, timing parameters, or frequency configurations tailored to their specific temperature and voltage conditions, allowing localized optimization without affecting overall system performance.

Inventive Principle:
Principle #3Local quality

3Reliability

If impedance adjusting circuit is activated to synchronize operation speeds, then operation performance is improved, but current consumption increases

Engineering Contradiction:
Improveoperation performanceVSAvoidcurrent consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The impedance adjusting circuit and calibration mechanisms are activated only when needed to synchronize operation speeds. The system uses detection enable signals to determine when calibration is necessary, avoiding continuous operation of adjustment circuits. This partial action approach maintains performance while minimizing unnecessary current consumption during normal synchronized operation.

Inventive Principle:
Principle #16Partial or excessive action

Data Source

PatentUS11200923B2Semiconductor apparatus
Publication Date: 2021.12.14 SK HYNIX INC
  • US11200923B2 patent drawing
  • US11200923B2 patent drawing
  • US11200923B2 patent drawing

AI summary

A semiconductor apparatus includes a first chip that generates a first oscillator signal in response to a detection enable signal and activates a ZQ circuit in response to a ZQ enable signal, and a second chip generates the ZQ enable signal by comparing frequencies of the first oscillator signal and a second oscillator signal with each other in response to the detection enable signal.