Condensation Suppression in Semiconductor Processing Apparatus
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Condensation in processing systems for semiconductor wafers can lead to electrical component failure due to moisture, and existing methods like using thermal insulators or heaters require additional space, making it difficult to scale down the apparatus.
Innovation Solution
A condensation suppressing method that involves measuring the surface temperature of apparatus members and dew-point temperature of air within a closed space, and controlling the supply of low-dew-point air to prevent condensation by maintaining a lower dew-point temperature inside the space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a coolant of low temperature is flown within the placing table to cool the semiconductor wafer, then the wafer temperature is maintained at the predetermined temperature, but the placing table temperature falls below room temperature causing condensation
Solution Approach 1:
The invention divides the cooling function into two separate systems: a cooling device that cools the wafer through the placing table, and a condensation preventing device that independently heats components prone to condensation. This segmentation allows the wafer to be cooled effectively while preventing condensation on specific components without requiring the entire placing table to be maintained at high temperature.
Solution Approach 2:
The condensation preventing device applies localized heating only to specific components that are susceptible to condensation (such as the lid, support structure, or electrical components), rather than heating the entire placing table. This local quality approach maintains cooling efficiency for the wafer while preventing condensation only where necessary.
2Object-affected harmful factors
If a thermal insulator or heating device is used to suppress condensation, then condensation is prevented, but additional space is required making scale-down difficult
Solution Approach 1:
The condensation preventing device is integrated with the existing placing table structure, merging the heating function into the current apparatus design. The heating device utilizes the placing table's existing structure and space, avoiding the need for separate, space-consuming thermal insulators or standalone heating devices.
Solution Approach 2:
The placing table structure serves multiple functions: it acts as both the cooling interface for the wafer and the mounting structure for the condensation preventing device. This multi-functionality eliminates the need for additional dedicated components, thereby reducing the overall apparatus volume.
3Temperature
If a component temperature falls below room temperature, then cooling performance is achieved, but condensation occurs on the component surface
Solution Approach 1:
The condensation preventing device applies preliminary heating to components before they reach condensation temperatures. By actively heating susceptible components, the system prevents condensation from occurring in the first place, rather than attempting to remove or mitigate condensation after it forms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses condensation on apparatus members, preventing electrical failures and allowing for more compact processing system designs by maintaining a controlled dew-point temperature within the closed spaces.
Implementation Method 1
a first surface temperature of a member of the processing apparatus, which is exposed within a closed space, is measured
Implementation Method 2
a dew-point temperature of air within the closed space is measured
Implementation Method 3
controlling the supply of low-dew-point air, which has a dew-point temperature lower than a dew-point temperature of air outside the processing apparatus, into the closed space
Data Source
AI summary
Condensation on a member of a processing apparatus can be suppressed. A condensation suppressing method of suppressing condensation in a processing apparatus configured to perform a processing on a processing target object includes a first measurement process, a second measurement process and a first control process. In the first measurement process, a first surface temperature of a member of the processing apparatus, which is exposed within a closed space, is measured. In the second measurement process, a dew-point temperature of air within the closed space is measured. In the first control process, a supply amount of low-dew-point air, which has a dew-point temperature lower than a dew-point temperature of air outside the processing apparatus, into the closed space is controlled based on the first surface temperature and the dew-point temperature of the air within the closed space.