Condensers and electronic assemblies
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Solution Overview
Problem
Liquid-cooled configurations for power electronics systems are costly and complex due to the need for external pump and radiator systems, which complicates heat management for high heat-flux power semiconductor devices.
Innovation Solution
A condenser design enabling passive, pumpless two-phase heat transfer using a condenser with vertical condensation channels and fins, allowing for efficient condensation of a coolant and effective heat removal from semiconductor devices without the need for external pumps or radiators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid-cooled configurations are used for high heat-flux power semiconductor devices, then heat removal efficiency is improved, but system complexity and cost increase due to external pump and radiator systems
Solution Approach 1:
The invention extracts the pump and radiator components from the liquid cooling system, eliminating the need for external pumping mechanisms and separate radiator assemblies. The condenser integrates the heat dissipation function directly into the phase change cooling loop, removing complex external components while maintaining effective heat removal from power semiconductor devices
Solution Approach 2:
The invention merges the evaporator and condenser functions into an integrated phase change cooling system. The condenser channels combine condensation surfaces and coolant flow paths in a unified structure that directly interfaces with the power electronics housing, eliminating the need for separate radiator systems and reducing overall system complexity
2Temperature
If liquid-cooled configurations are used for high heat-flux power semiconductor devices, then heat removal efficiency is improved, but cost increases due to external pump and radiator systems
Solution Approach 1:
The invention removes the expensive external pump and radiator components from the cooling system. By using passive phase change cooling where the condenser directly condenses coolant vapor and returns liquid coolant through gravity and capillary action, the system eliminates costly mechanical components and complex assembly requirements
Solution Approach 2:
The condenser system operates autonomously using passive two-phase heat transfer. The phase change process naturally drives coolant circulation without external pumps, and the condenser structure self-regulates coolant flow and heat dissipation, reducing the need for expensive control systems and external components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an efficient and cost-effective cooling method for power-dense power electronics by utilizing passive two-phase heat transfer, improving heat management and reducing system complexity while maintaining high heat transfer efficiency.
Implementation Method 1
The condenser may be used in multiple applications that having two-phase cooling of a concentrated heat source
Implementation Method 2
The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall
Implementation Method 3
A condenser design enabling passive, pumpless two-phase heat transfer using a condenser with vertical condensation channels and fins
Implementation Method 4
Some example embodiments include condensers having features that may enable passive two-phase heat transfer for power-dense power electronics applications
Data Source
Figure 1a~1b
Figure 2a
Figure 2b
AI summary
Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.