Conduction Cooled Semiconductor Laser Heat Sink Design
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Solution Overview
Problem
Conduction cooled high power semiconductor lasers face low yield, poor heat dissipation, and low reliability due to complex bonding processes and difficulties in soldering copper tungsten to insulated plates, leading to inefficient heat transfer and increased failure rates.
Innovation Solution
A method involving bonding semiconductor laser units with high thermal conductivity substrates to insulation plates for heat dissipation, followed by testing, aging, and screening, and then soldering these units onto heat sinks with insulation plates for improved heat transfer and reliability, utilizing materials like copper, copper tungsten, and ceramic insulation plates with high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of laser bars are simultaneously bonded together with copper tungsten to form bars module, then the structure is formed, but the yield is low because the product becomes unusable if one chip is damaged
Solution Approach 1:
The invention divides the laser system into independent laser units, each with its own heat dissipation path through substrate and insulation plate to heat sink. This segmentation allows individual units to be tested and screened separately, so that failure of one unit does not affect the functionality of other units, thereby improving both yield and reliability.
Solution Approach 2:
The invention implements preliminary testing, aging, and screening of each laser unit before final assembly. This preliminary action identifies and eliminates defective units early in the manufacturing process, preventing them from being assembled into the final product and thus improving yield while ensuring reliability of the assembled system.
2Ease of manufacture
If copper tungsten is soldered to insulated plate in the middle of bars module, then the structure is completed, but heat dissipation and reliability are poor due to complicated process
Solution Approach 1:
The invention extracts the heat dissipation function from the complex internal soldering process and implements it through a dedicated heat sink structure. Each laser unit has its own substrate and insulation plate that directly contacts the heat sink, eliminating the need for complicated internal soldering of copper tungsten to insulation plates while improving heat dissipation efficiency.
Solution Approach 2:
The invention introduces substrate and insulation plate as intermediary components between the laser chip and heat sink. These intermediaries provide direct thermal conduction paths and simplify the manufacturing process by eliminating the need for complex soldering operations in the middle of the bars module, thereby improving both ease of manufacture and heat dissipation efficiency.
3Reliability
If conduction cooled method with hard solder packaging is used, then reliability under harsh environments is improved, but manufacturing complexity increases
Solution Approach 1:
The invention merges the insulation and heat dissipation functions into a single insulation plate component that is soldered directly to the heat sink. This merging simplifies the packaging structure by eliminating the need for separate insulation and heat dissipation components, reducing manufacturing complexity while maintaining the reliability benefits of conduction cooled hard solder packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances yield, reduces costs, improves heat dissipation efficiency, and ensures high reliability, making the semiconductor lasers suitable for harsh environments with improved performance and longevity.
Implementation Method 1
a substrate bonded to the laser chip for heat dissipation and electrical connection
Implementation Method 2
an insulation plate soldered to the substrate for insulation and heat dissipation, wherein the thermal conductivity of the above-mentioned insulation plate is higher than 120 W/(m2·K)
Implementation Method 3
the heat sink above has a heat radiation structure with a manner of water cooling, air cooling or electronic cooling
Implementation Method 4
water cooling, air cooling or electronic cooling
Data Source
AI summary
A conduction cooled high power semiconductor laser and a method for fabricating the same are provided. The conduction cooled high power semiconductor laser comprises a heat sink (2) and one or more semiconductor laser units (1). The semiconductor laser unit consists of a laser chip (3), a substrate (4) bonded to the laser chip for heat dissipation and electrical connection, and an insulation plate (5) soldered to the substrate for insulation and heat dissipation. The semiconductor laser unit is soldered on the heat sink with the insulation plate therebetween. The semiconductor laser unit may be tested, aged, and screened in advance, and thereby the yield of the lasers can be improved and the manufacturing costs can be reduced. The laser has desirable heat dissipation performance, high reliability, and is applicable to high temperature and other complex and volatile environments.