A lens on a resin substrate focuses laser energy between closely spaced emitters and detectors.
A laser pump module switches diode subsets to adjust power levels while maintaining stable emission wavelengths.
A deformometer uses dual-wavelength lasers and beam splitters to detect optical cavity distortions.
Superposed laser chip rows on an insulating carrier prevent electric arcs while delivering uniform radiation distribution.
Suction through microholes aligns laser diode front edges against an alignment plate, resolving trade-offs between precision and manufacturing complexity.
An optical tap extracts a monitoring signal from the multiplexer output to measure individual laser power levels.
Integrated laser system directs light from multiple sources through optical combining devices to resolve wavelength range limitations.
Segmented laser modules with positioning grooves reduce disassembly time and complexity.
A light source module uses an optical element with varying directional power to superimpose beams of different wavelengths.
Adiabatically curving waveguides on a photonic integrated circuit combine RGB light beams while suppressing crosstalk and reducing device volume.
A multi-mode interference multiplexer uses a reflecting surface to redirect light toward a single-mode waveguide.
A polarization control member aligns and combines light from multiple semiconductor laser elements using dichroic mirrors and waveplates.
Shared thermal management between diode laser arrays and drive electronics eliminates duty cycle constraints while reducing overall system cost.
An addressable VCSEL array generates structured light dot patterns by selectively activating independent groups of emitters through conductive traces.
Self-heating laser diodes eliminate slow warm-up times and extra heating components, enabling stable image output in low temperature environments.
A diode laser arrangement uses DCB bonding to join active heat sinks and intermediate carriers into a monolithic structure for thermomechanical symmetry.
A segmented cooling jacket creates temperature differences between laser element groups to widen the output spectrum.
A pump device uses a cylindrical surface to collimate laser beams from diodes.
Segmented laser units with dedicated thermal paths eliminate complex internal copper tungsten soldering, boosting yield and reliability in harsh environments.
A deformometer system uses multiple laser wavelengths to detect optical cavity deformation through precise refractive index analysis.
A laser light source apparatus includes an optical intensity adjusting section that compensates for intensity changes caused by frequency variations.
A fiber-delivered laser source uses a volume holographic grating to narrow spectral linewidth and stabilize wavelength output.
A photonic chip with a modulated Bragg reflector alters the dominant wavelength of secondary electromagnetic radiation to minimize speckle interference.
Fused ceramic sheets route coolant and integrate circuitry to manage thermal loads in high-power laser diode arrays.
An intermediate CTE submount reduces thermal mismatch stress on laser diodes, enabling hard soldering without degradation.
Cascaded difference frequency generators convert pump light through intermediate wavelengths to boost long wave infrared power delivery efficiency.
An optical assembly uses a microlens array to homogenize the angular distribution of laser radiation at the beam waist between imaging lenses.
Replacing solid chilling plates with lightweight fin structures reduces system mass and volume while maintaining optical alignment.
A laser ignition device uses a transmissive reflective film to suppress oscillated light leakage toward the semiconductor laser element.
A diode laser bar sandwich assembly uses paired platelets to manage mechanical stress and reduce thermal resistance.
A packaged laser array integrates a III-V chip with a silicon substrate and lens array to maintain isolator magnetization during thermal reflow.
A segmented optical member positions an optical film and metal film on a main body to extract light and conduct heat.
An insulated heat-conducting board routes thermal energy through a dedicated base, resolving insufficient dissipation in high-power laser diodes.
A two-lens optical system refracts laser beams to widen the spread angle before wavelength conversion.
A laser diode driving power supply uses a control unit to manage current command values and switching elements for stable operation.
Merging laser chip with phosphor layer eliminates separate optical elements, resolving device size and thermal dissipation trade-offs.
Segmenting the antenna layer into uniform and non-uniform regions maintains high resolution while reducing parasitic peaks in beam steering devices.
A direct diode-pumped Ti:sapphire amplifier uses fiber-coupled blue-violet laser diodes to deliver pump light.
A monolithic optical coupling module uses total internal reflection surfaces to split input beams into multiple output paths.
A single-chip series-connected VCSEL array design uses metallization patterns to link electrically separate conductive regions.
Vacuum reflow joins laser diode bars, minimizing substrate oxidation and preventing coating damage during fabrication.
Silicon-on-insulator wafer with backside optical vias enables flip-chip attachment of optoelectronic devices directly onto CMOS integrated circuits.
Merges discrete optical components onto a unified silicon platform using CMOS-compatible processes, eliminating manual assembly bottlenecks.
A multi-beam laser power control circuit determines automatic power control signal priority to execute sequential operations.
A semiconductor light-emitting device uses individual current control elements for each serial column to balance electrical flow.
A laser diode light-emitting device uses a segmented wavelength conversion member to enhance luminance and uniformity.
A crystalline color-conversion device merges a blue LED with an inorganic single-crystal phosphor to produce white light.