SWAP Laser Diode Pump Thermal Management
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Solution Overview
Problem
Conventional high-power fiber laser diode pumps are inefficient in terms of size, weight, and power due to the use of heavy, voluminous materials for waste heat removal, which is not suitable for mobile or High Energy Laser applications requiring lower volume, weight, and improved electrical-to-optical power conversion efficiency.
Innovation Solution
A Low Size Weight and Power (SWAP) efficient Laser Diode pump design utilizing lighter materials with high thermal conductance, such as surface-area fins, and a shared coolant manifold to reduce mass and volume while maintaining optical alignment and efficiency, replacing traditional solid chilling plates with a compact, efficient thermal management system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional solid chilling plates made of highly thermally conductive material (e.g., copper) are used for cooling high-powered laser diode pumps, then effective waste heat removal is achieved, but significant excess mass and volume are added to the laser system
Solution Approach 1:
The patent changes the thermal management approach from using solid high-density thermally conductive materials (copper chilling plates) to using lightweight materials with high surface-area-to-volume ratio structures (fins). This parameter change in thermal conductance per unit mass enables effective heat removal with significantly reduced system mass, achieving the target of 0.5 kg/kW specific mass.
Solution Approach 2:
The patent transitions from two-dimensional solid plate heat dissipation to three-dimensional fin structures with high surface area. By adding the dimensional aspect of extended surfaces, the heat transfer area is dramatically increased without proportionally increasing mass, resolving the contradiction between heat removal effectiveness and system weight.
2Temperature
If conventional solid chilling plates are used for cooling, then thermal management is achieved, but the system volume becomes excessively large for mobile and High Energy Laser applications
Solution Approach 1:
The patent changes the geometric parameters of the thermal management system by replacing solid plates with fin structures. This structural parameter change provides high surface-area-to-volume ratio, enabling effective heat dissipation in a compact form factor suitable for mobile and High Energy Laser applications.
3Reliability
If conventional industrial diode laser designs are used, then manufacturing experience and reliability are leveraged, but electrical-to-optical power conversion efficiency is only approximately 50% whereas High Energy Laser applications require 55% efficiency
Solution Approach 1:
The patent optimizes thermal management parameters (thermal conductance, surface area, material selection) to improve the operating temperature and efficiency of the laser diodes. By maintaining optimal thermal conditions through the fin structure, the electrical-to-optical conversion efficiency is enhanced from 50% to exceed 55% while preserving system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a 4× smaller footprint, 10× smaller mass, and 10% higher efficiency compared to conventional systems, with a specific mass of 0.5 kg/kW, enabling more compact and efficient power scaling for high-energy applications.
Implementation Method 1
high surface-area fins (or similar structures) attached to the laser diode submount and located inside a hollowed-out housing to improve the thermal conductance by three times
Implementation Method 2
A manifold shared by two or more LSLD pumps may be used to introduce coolant to remove excess heat dissipated by the fins of the two or more LSLD pumps
Data Source
AI summary
A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount. The device further comprising a housing coupled to the LSLD assembly, the housing comprising a carrier structure having an aperture configured to support the LSLD assembly on a first side and having a plurality of channels on a second side, a bottom segment configured to couple to the carrier segment to create an enclosure around the channels between a top side of the bottom segment and the second side of the carrier structure, an inlet and outlet formed in the housing for transporting a coolant into and out of the channels in the enclosure, wherein the members are disposed within the enclosure so as to expose the members to the coolant.