Semiconductor Laser Cooling Jacket for Speckle Noise Reduction
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Solution Overview
Problem
Existing semiconductor laser devices for projectors face complex configurations and control requirements to reduce speckle noise, which is caused by the coherence of laser light, due to the need for individual cooling parts and temperature control for each semiconductor laser element.
Innovation Solution
A semiconductor laser device with a cooling jacket that divides semiconductor laser elements into two groups, where one group is cooled more efficiently than the other by a cooling medium channel, creating a temperature difference that widens the output spectrum width and reduces speckle noise without complex control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If individual cooling parts are provided for each semiconductor laser element, then the cooling temperature can be controlled differently for each element to reduce speckle noise, but the configuration becomes complex and requires complex control
Solution Approach 1:
The cooling jacket is divided into multiple cooling regions, each with its own cooling medium channel. This segmentation allows different cooling temperatures to be applied to different groups of semiconductor laser elements, creating wavelength differences that reduce speckle noise while maintaining a relatively simple overall structure.
Solution Approach 2:
Different regions of the cooling jacket are designed with different cooling characteristics by varying the cooling medium channel configurations (such as channel cross-sectional areas, distances from laser elements, or flow rates). This creates local temperature differences that cause wavelength shifts in the laser output, effectively reducing speckle noise without requiring complex active control systems.
2Object-affected harmful factors
If individual cooling parts are provided for each semiconductor laser element, then the cooling temperature can be controlled differently for each element, but the number of cooling parts increases
Solution Approach 1:
Multiple cooling medium channels are integrated into a single cooling jacket structure, allowing multiple cooling functions to be performed by one unified cooling device. This reduces the total number of separate cooling parts while still enabling different cooling temperatures for different laser element groups.
Solution Approach 2:
The cooling jacket serves multiple functions simultaneously: it provides thermal management for multiple laser element groups, creates wavelength diversity through differential cooling, and maintains structural support. This multi-functionality reduces the need for separate dedicated cooling components for each laser element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces speckle noise by widening the output spectrum width of laser light, improving image quality with a simpler cooling system that does not require intricate temperature control for each element.
Implementation Method 1
a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes
Implementation Method 2
Since the semiconductor laser elements have temperature characteristics, wavelengths of laser light outputted by the semiconductor laser elements in the two regions are different from each other corresponding to the cooling temperature difference
Data Source
AI summary
There is provided a semiconductor laser device including a plurality of members constituting a first group and a second group in each of which a semiconductor laser element is incorporated, a cooling jacket having, on a surface of the cooling jacket, a first region in which the member of the first group is disposed and a second region in which the member of the second group is disposed, and a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes.