Silicon Photonic Transceiver Module Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current optical communication devices have high costs, large sizes, low reliability, and limited performance due to the discrete production of modulators, semiconductor lasers, and other components, requiring intensive human labor and a lack of universal process standards, leading to high capital investment and low flexibility in meeting market demands.
Innovation Solution
A highly integrated multi-channel optical transceiver module based on a silicon photonic chip, integrating a silicon photonic transmitter and receiver chip with an electronic chip on a printed circuit board, utilizing a Ge/Si distributed feedback laser array, Ge/Si waveguide electro-absorption modulator array, and thermal-insulation V-shaped grooves for optical fiber connectors, compatible with CMOS amplifiers for low power consumption and high-speed data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete production model is used for optical devices, then various optical components can be manufactured using specialized processes, but the device size becomes large, cost increases, and reliability decreases
Solution Approach 1:
The patent merges multiple discrete optical components (laser, modulator, multiplexer, photodetector) onto a single silicon photonic chip using silicon-based optical circuit integration technology. This consolidation reduces the overall device size and component count while maintaining manufacturing flexibility through standardized silicon fabrication processes compatible with CMOS technology.
Solution Approach 2:
The silicon photonic chip serves multiple functions simultaneously - generating light, modulating signals, multiplexing wavelengths, and detecting optical signals - all within a single integrated platform. This multi-functional approach eliminates the need for separate specialized manufacturing processes for each component type.
2Ease of manufacture
If discrete production model is used for optical devices, then specialized materials can be used for each component, but production cost increases and scalability decreases
Solution Approach 1:
The patent transitions from specialized materials (indium phosphide for lasers, lithium niobate for modulators) to a unified silicon-based platform that uses standard silicon fabrication parameters. This parameter change enables the use of existing CMOS manufacturing infrastructure, dramatically improving production scalability and reducing costs while maintaining component functionality through optimized silicon photonic design.
3Reliability
If vertical integration business model is used, then companies can control entire production process, but capital investment increases and profit margin decreases
Solution Approach 1:
The patent segments the optical device production into a standardized silicon photonic chip platform that can be manufactured using existing semiconductor industry infrastructure. This segmentation allows companies to leverage established CMOS fabrication capabilities rather than requiring complete vertical integration, reducing capital investment while maintaining production control through standardized interfaces and processes.
4Ease of manufacture
If conventional optical device production is used, then human labor is required for assembly, but production efficiency decreases and cost increases
Solution Approach 1:
The patent replaces manual assembly operations with automated semiconductor fabrication processes. The silicon photonic chip integrates all optical components using standardized semiconductor manufacturing techniques that are inherently automated, eliminating the need for intensive human labor in assembly while dramatically improving production efficiency and consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces component count by over 50% compared to conventional devices, enables batch production, and simplifies the production process, resulting in lower costs and higher reliability with enhanced compatibility and scalability.
Implementation Method 1
Ge/Si distributed feedback laser array
Implementation Method 2
Ge/Si waveguide electro-absorption modulator array
Implementation Method 3
Ge waveguide photodetector array
Implementation Method 4
thermal-insulation V-shaped grooves for optical fiber connectors
Data Source
AI summary
A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding. The present invention provides a high-data-rate, low-power-consumption, and cost-effective solution for optical transceiver modules and active optical cables based on silicon photonic chip technology.