Laser Emitter Module Rows for Uniform Heating
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Solution Overview
Problem
Current laser emitter modules for heating plastic container preforms struggle to achieve homogeneous heating profiles efficiently and economically, particularly due to the limitations in laser chip density and radiation distribution, which affects the precision and cost-effectiveness of the heating process.
Innovation Solution
A laser emitter module architecture featuring superimposed rows of laser chips with a specific arrangement and power supply configuration, allowing for increased implantation density and uniform spatial distribution of radiation, while maintaining a safe distance to prevent electric arcs and ensuring effective heating between chips, enabling flexible and cost-effective heating profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser chips are arranged in multiple rows with increased implantation density to achieve homogeneous heating profiles, then heating uniformity is improved, but the risk of electric arcs between adjacent chips increases
Solution Approach 1:
The patent introduces an insulating substrate as an intermediary between adjacent laser chip rows. This substrate with its insulating properties prevents electric arc formation while allowing the chips to be positioned in a dense grid pattern for homogeneous heating. The intermediary material resolves the contradiction by providing electrical isolation without compromising the spatial arrangement needed for uniform heat distribution.
Solution Approach 2:
The patent implements equipotentiality by connecting all laser chips to a common ground potential through the insulating substrate structure. By establishing equal potential across adjacent chips, the electric field differences that would drive arc formation are eliminated, allowing dense chip arrangement without harmful discharges.
2Temperature
If a subset of LEDs extending over most of the oven's height is used to ensure heating coverage, then heating coverage is improved, but the cost of the component increases significantly
Solution Approach 1:
The patent segments the heating system into multiple independent laser emitter modules, each containing a manageable array of laser chips. This segmentation allows the heating function to be distributed across several smaller, more cost-effective units rather than requiring one expensive continuous component spanning the entire oven height. Each module can be manufactured and assembled separately.
Solution Approach 2:
The patent transitions from a vertical arrangement (extending over oven height) to a two-dimensional grid arrangement of laser chips on horizontal substrates. This dimensional change allows comprehensive heating coverage through spatial distribution in the X-Y plane rather than requiring vertical extension, reducing component cost while maintaining effective heating area.
3Use of energy by moving object
If laser chips are positioned close together to increase power density and heating efficiency, then energy efficiency is improved, but the precision of emitted radiation distribution becomes difficult to control
Solution Approach 1:
The patent replaces mechanical positioning methods with a standardized grid pattern defined by the insulating substrate structure. The substrate's built-in positioning features ensure precise, repeatable chip placement without requiring complex mechanical alignment processes, maintaining radiation distribution precision even at high chip densities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the homogeneity and reliability of the heating process, reduces costs, and allows for adaptable heating patterns, improving the efficiency and flexibility of the heating module, making it suitable for high-volume production requirements.
Implementation Method 1
whose chips are designed to emit in the infrared range
Implementation Method 2
laser chips arranged in at least two rows of laser chips
Implementation Method 3
obtain a uniform spatial distribution of the rows, and therefore a homogeneous radiation of the chips
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
Module (33), comprising a body (35) and a series of laser emitters (1), each of the laser emitters (1) being superposed and fastened to the body (35), and comprising: a carrier (3) having a frontal face (4) and bounded, on either side of its frontal face (4), with an upper lateral face (6) and a lower lateral face (7) that are opposite; and laser chips (2) mounted on the frontal face (4) of the carrier (3), at least one supply (15) supplying the laser chips (2) with electrical current; characterized in that for at least two of the laser emitters (1) superposed and fastened to the body: - the laser chips (2) are arranged in at least two rows (9, 10) of laser chips, including: - an upper row (9) having an external edge (11) turned toward the upper lateral face (6) of the carrier (3) and an opposite internal edge (12), - a lower row (10) having an external edge (13) turned toward the lower lateral face (7) of the carrier (3) and an opposite internal edge (14); and - the distance E1 between the internal edges (12, 14) of two parallel and adjacent rows (9, 10) of chips (2) is larger than or equal to the sum of the distance E3 from the external edge (11) of the upper row (9) to the upper lateral face (6) and of the distance E4 from the external edge (13) of the lower row (10) to the lower lateral face (7).