Laser Component Integrated Conversion Element Thermal Management
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Solution Overview
Problem
Conventional laser components with separate conversion elements for generating white light radiation are less compact and inefficient in heat dissipation, leading to reduced luminance and increased size.
Innovation Solution
A laser component with an integrated conversion element within the housing, featuring a phosphor layer, reflective layer, and thermally conductive layers for efficient heat dissipation and radiation conversion, allowing for compact design and high luminance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate conversion element is used at a distance from the laser component, then thermal energy can be dissipated laterally, but the overall device size increases and compactness is reduced
Solution Approach 1:
The conversion element is integrated directly into the housing of the laser component, merging previously separate components (laser chip, conversion element, housing) into a single compact unit. This eliminates the need for a separate distant conversion element while maintaining thermal management capabilities through the housing structure itself.
Solution Approach 2:
The housing serves multiple functions: it provides structural enclosure, acts as a thermal management pathway for dissipating heat from the conversion element, and integrates the conversion element itself. This multi-functionality reduces the need for additional separate components for thermal management.
2Use of energy by moving object
If optical elements like lenses or integrators are used to project blue light onto the conversion element, then radiation conversion can be achieved, but the device complexity and number of components increases
Solution Approach 1:
The patent eliminates the need for separate optical elements (lenses, integrators) by directly coupling the laser chip to the conversion element within the integrated housing structure. The laser radiation is projected onto the conversion element through direct optical coupling without intermediate optical components, simplifying the overall device architecture.
3Temperature
If the conversion element is arranged at a distance from the laser chip, then thermal management can be improved, but the luminance and compactness are reduced
Solution Approach 1:
The housing provides three-dimensional thermal management pathways, allowing heat to be conducted away from the conversion element through the housing structure in multiple directions. This spatial arrangement enables effective thermal management while maintaining close proximity between the laser chip and conversion element for high luminance output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated conversion element enables compact design, efficient heat dissipation, and high luminance radiation emission, eliminating the need for additional optical elements and enhancing performance in applications like vehicle headlights.
Implementation Method 1
The conversion element is situated at a distance from the laser component(s). With the aid of the conversion element, the blue light radiation may be at least partly converted such that a white light radiation may be generated.
Implementation Method 2
a thermally conductive layer (163) arranged on the reflective layer (162)
Data Source
AI summary
A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.