Conductive Base Material Processing for Low-Resistance Conductive Films
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Solution Overview
Problem
Conductive films formed using existing methods have high specific resistance due to the presence of oxide films on the surface of conductive particles, limiting further reduction in resistivity.
Innovation Solution
A method involving a laminating step, impregnation with a component to remove oxide films, and pressurization to form a conductive film, with controlled pressure application and optional heating, to reduce the specific resistance of the conductive film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive composition containing conductive particles is used to form a conductive film, then the conductive film can be produced, but the specific resistance of the film is high due to oxide films on the conductive particles
Solution Approach 1:
The patent applies preliminary action by treating the conductive particles with a reducing agent before forming the conductive film. This preliminary reduction treatment removes the oxide films from the conductive particles in advance, so that when the particles are assembled into a conductive film, they already have clean surfaces that facilitate better electrical contact and lower specific resistance.
Solution Approach 2:
The patent converts the harmful oxide films on conductive particles into a beneficial process by using a reducing agent. The reducing agent reacts with the oxide films to remove them, transforming the harmful oxidation state into a beneficial reduced state. This conversion allows the conductive particles to achieve lower specific resistance in the final film while maintaining the ease of particle assembly.
2Reliability
If conventional heating and pressurization methods are used to form the conductive film, then the conductive film can be formed, but the specific resistance cannot be reduced further
Solution Approach 1:
The patent applies parameter changes by introducing a reducing agent into the conductive composition or treatment process. This chemical parameter change enables the removal of oxide films from conductive particles, which directly reduces the specific resistance of the resulting conductive film. The reducing agent modifies the chemical state of the particles without fundamentally changing the physical manufacturing process.
3Reliability
If the conductive particle-containing layer is pressurized to form the conductive film, then the specific resistance decreases, but the pressure application requires precise control
Solution Approach 1:
The patent applies preliminary action by performing reducing agent treatment before pressurization. This preliminary chemical treatment removes oxide films that would otherwise interfere with particle contact during pressurization. As a result, the subsequent pressurization step requires less precise control because the particles are already prepared for optimal contact, reducing the sensitivity to pressure variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the specific resistance of the conductive film by removing oxide films, resulting in a conductive film with improved conductivity.
Implementation Method 1
an impregnation step of impregnating a component (X) capable of removing an oxide film on a surface of the conductive particles into the conductive particle-containing layer
Implementation Method 2
a conductive film formation step of at least pressurizing the conductive particle-containing layer impregnated with the component (X) to form a conductive film
Data Source
AI summary
A method for producing a conductive base material, the method includes: (1) a laminating step of forming a conductive particle-containing layer on a surface of a base material using a conductive composition containing conductive particles, to obtain a laminate including a base material layer and the conductive particle-containing layer; (2) an impregnation step of impregnating a component (X) capable of removing an oxide film on a surface of the conductive particles into the conductive particle-containing layer; and (3) a conductive film formation step of at least pressurizing the conductive particle-containing layer impregnated with the component (X) to form a conductive film.