Thermally Conductive Carrier for Low-Temperature Baffle Expansion

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Solution Overview

Problem

Existing thermally expandable compositions in baffle and reinforcement elements require higher temperatures and longer times for expansion, which is inefficient and may not be suitable for larger carrier elements.

Innovation Solution

A baffle or reinforcement element comprising a thermally expandable composition and a carrier element made of a plastic material with a thermal conductivity of more than 0.6 W/(mK), which facilitates faster expansion at reduced temperatures (140-150°C) for 10-15 minutes, suitable for larger elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional thermally expandable compositions are used, then the composition can expand and fill cavities, but the expansion requires high temperatures and long time which is inefficient

Engineering Contradiction:

Improveexpansion speedVSAvoidexpansion temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent changes the thermal conductivity parameter of the carrier material from conventional low values to more than 0.6 W/(mK), which fundamentally alters the heat transfer characteristics and enables faster expansion at lower temperatures

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite carrier materials combining plastic matrices with thermally conductive fillers (metal powders, metal oxides, carbon-based materials) to achieve the required thermal conductivity while maintaining structural integrity

Inventive Principle:

Principle #40Composite materials

2Productivity

If conventional carrier materials with low thermal conductivity are used, then the material can be easily manufactured, but the expansion process becomes too slow for practical applications

Engineering Contradiction:

Improveexpansion timeVSAvoidcarrier material processing

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent employs composite materials consisting of plastic matrices combined with thermally conductive fillers, achieving high thermal conductivity while maintaining ease of manufacturing through conventional processing techniques

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies thermally conductive fillers specifically in the carrier material where thermal transfer is needed, rather than throughout the entire structure, optimizing thermal performance where required while maintaining manufacturing simplicity

Inventive Principle:

Principle #3Local quality

3Productivity

If the carrier element is made with high thermal conductivity material, then the expansion efficiency is improved, but the weight of the carrier element increases

Engineering Contradiction:

Improveexpansion efficiencyVSAvoidcarrier element weight

Core Design Contradiction:

ProductivityVSWeight of moving object

Solution Approach 1:

The patent uses composite materials with plastic matrices and dispersed thermally conductive fillers, achieving high thermal conductivity while maintaining low weight due to the lightweight nature of the plastic matrix and efficient filler distribution

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent concentrates thermally conductive fillers in specific regions where thermal transfer is most needed, rather than uniformly distributing them throughout the entire carrier, optimizing thermal performance while minimizing weight increase

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient and rapid expansion of the thermally expandable composition, enhancing the sealing and reinforcing capabilities of hollow structures by filling cavities effectively and adhering to walls, particularly in automotive applications.

Implementation Method 1

The carrier element consists of a plastic material MA with a thermal conductivity of more than 0.6 W/(mK), determined according to ASTM D5470

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

one or more layers of a thermoplastic material attached to it which is able to expand its volume when heat or another physical or chemical form of energy is applied

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP4707132A1Thermaly conductive carrier for baffle or reinforcement element

Publication Date: 2026.03.11 SIKA TECH AG

AI summary

Disclosed is a baffle and/or reinforcement element comprising a thermally expandable composition TEC and a carrier element, wherein the carrier element consists of a plastic material MA with a thermal conductivity of more than 0.6 W/(mK), determined according to ASTM D5470. Said baffle and/or reinforcement element allows for an improved expansion of the thermally expandable composition upon exposure to reduced temperatures for limited time, preferably 10 - 15 min at 140 - 150 °C.