Conductive Clip for Semiconductor Package Heat Dissipation
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Solution Overview
Problem
Existing semiconductor die packages face challenges in achieving efficient heat dissipation and low resistance connections while being compatible with standard pinouts and accommodating differently sized devices, with current solutions either requiring flip-chip processes or not providing adequate stress release structures.
Innovation Solution
A semiconductor device package utilizing a V-shaped or source clip with separate parallel conductive fingers and bridges that provide multiple electrical paths, reducing spreading resistance and incorporating a stress release structure, allowing for compatibility with standard pinouts and flexibility in device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-point electrical contact is used to connect the semiconductor die to the lead frame, then the device complexity is reduced, but the spreading resistance increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The clip is divided into multiple parallel conductive fingers that contact the source region at different points. This segmentation creates multiple electrical pathways from the source region to the lead frame, reducing spreading resistance while maintaining a relatively simple overall structure. The multiple contact points distribute the electrical current flow, preventing concentration at a single point.
Solution Approach 2:
The conductive fingers extend in multiple directions and planes to contact the source region, transitioning from a single-point contact to a distributed multi-dimensional contact network. This dimensional expansion allows electrical current to flow through multiple parallel paths, reducing resistance without significantly increasing structural complexity.
2Reliability
If a large contact area is used to reduce spreading resistance, then electrical connection improves, but the stress release capability deteriorates due to rigid bonding
Solution Approach 1:
The contact area is segmented into multiple discrete contact points through the parallel fingers, each making contact at specific locations on the source region. This segmentation reduces the continuous rigid bonding area, allowing for stress release while maintaining multiple electrical pathways for low resistance connection.
Solution Approach 2:
The clip structure incorporates flexible elements that can deform to accommodate thermal expansion and mechanical stress. The thin finger structures provide flexibility while maintaining electrical conductivity, allowing the clip to adapt to stress without compromising the electrical connection quality.
3Reliability
If a complex stress release structure is added to accommodate thermal expansion, then the reliability improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The clip uses flexible thin finger structures that inherently accommodate thermal expansion through elastic deformation. This flexible design provides stress release capability without requiring complex additional structures, maintaining relatively simple packaging while improving reliability under thermal cycling conditions.
Solution Approach 2:
The clip structure is designed to be dynamically adaptable, allowing the fingers to move and deform in response to thermal and mechanical stresses. This dynamic behavior enables the structure to accommodate expansion and contraction cycles without requiring complex static stress release mechanisms.
4Ease of operation
If standard pinout compatibility is achieved through fixed clip geometry, then ease of operation improves, but adaptability to differently sized devices deteriorates
Solution Approach 1:
The segmented finger structure allows independent adjustment of each finger's position and contact point. This segmentation enables the same clip design to accommodate variations in device size by adjusting which fingers make contact and at what positions, while maintaining standard pinout compatibility through the overall arrangement of contact points.
Solution Approach 2:
The clip design incorporates dynamic adjustability, allowing the fingers to be positioned or deformed to match different device geometries. This dynamic capability enables a single clip design to work with multiple device sizes while maintaining compatibility with standard pinout configurations through flexible positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances heat dissipation, reduces electrical resistance, and provides a rugged stress release structure, making it compatible with standard semiconductor pinouts and adaptable to various device sizes, while maintaining mechanical strength and flexibility.
Implementation Method 1
separate parallel conductive fingers and bridges that provide multiple electrical paths, reducing spreading resistance
Implementation Method 2
enhances heat dissipation
Data Source
AI summary
A clip for a semiconductor device package may include two or more separate electrically conductive fingers electrically connected to each other by one or more electrically conductive bridges. A first end of at least finger is adapted for electrical contact with a lead frame. The bridges are adapted to provide electrical connection to a top semiconductor region of a semiconductor device and may also to provide heat dissipation path when a top surface of the fingers is exposed. A semiconductor device package may include the clip along with a semiconductor device and a lead frame. The semiconductor device may have a first and semiconductor regions on top and bottom surfaces respectively. The clip may be electrically connected to the top semiconductor region at the bridges and electrically connected to the lead frame at a first end of at least one of the fingers.