Conductive Clip Semiconductor Package for High Current and Thermal Management
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Solution Overview
Problem
Conventional power semiconductor packages face limitations in high current carrying capability, low thermal resistance, and high I/O count within a small footprint, especially in high voltage and temperature applications, due to constraints in bond wire lengths and fused lead designs.
Innovation Solution
A semiconductor package design featuring conductive clips and leads that provide dedicated low resistance connections and additional I/O capacity, with clips oriented transversely relative to leads and connectors, allowing for efficient current flow and increased terminal access, and an encapsulant body that exposes clip ends for external contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bond wire lengths and fused leads are used, then the package structure is simple, but the current carrying capability is limited and thermal resistance is high
Solution Approach 1:
The electrical connection path is segmented into multiple independent components: clips attached to the die, connectors attaching the clips to leads, and leads extending to the package exterior. This segmentation allows each component to be optimized for its specific function, enabling high current carrying capability while maintaining a manageable overall structure.
Solution Approach 2:
The clips are oriented transversely (perpendicularly) relative to the leads, creating a three-dimensional arrangement rather than a linear configuration. This dimensional change allows current to flow through multiple parallel paths simultaneously, increasing current carrying capability without proportionally increasing package footprint.
2Reliability
If fused lead designs are used, then thermal management is improved, but the I/O count is reduced
Solution Approach 1:
The connection system is divided into separate functional elements (clips, connectors, leads) that can be independently configured. This allows thermal management features to be implemented in specific components without limiting the number of available I/O connections, as each lead can serve independent functions.
Solution Approach 2:
The leads serve multiple functions: they provide electrical connections, support thermal management, and enable high I/O counts. The modular connector system allows the same lead structure to accommodate various connection configurations, making the package adaptable to different application requirements while maintaining thermal performance.
3Adaptability or versatility
If more I/O terminals are added to increase I/O count, then versatility is improved, but the package footprint increases
Solution Approach 1:
The transverse orientation of clips relative to leads creates a three-dimensional connection architecture that maximizes the use of vertical space rather than horizontal footprint. Multiple I/O connections can be stacked or arranged in layers, increasing I/O count without proportionally increasing the package's planar dimensions.
Solution Approach 2:
The connector system allows for nested or layered arrangements where clips, connectors, and leads are arranged in multiple levels. This nesting enables multiple I/O connections to be packed into a compact volume, increasing I/O density without expanding the package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances current carrying capability, reduces thermal resistance, and increases I/O count within a compact package, addressing the limitations of conventional solutions by optimizing clip and lead configurations for high current and temperature conditions.
Implementation Method 1
conductive clips and leads that provide dedicated low resistance connections
Implementation Method 2
designed to accommodate high temperature operation, which may induce thermal expansion of the package materials
Data Source
AI summary
A packaged semiconductor device includes a carrier having a die attach surface, a semiconductor die mounted on the die attach surface and comprising first and second conductive terminals disposed on an upper side, a first clip that extends over the semiconductor die and is electrically connected to the first conductive terminal, a second clip that extends over the semiconductor die and is electrically connected to the second conductive terminal, and an electrically insulating encapsulant body that encapsulates the semiconductor die. An outer end of the first clip is exposed from the encapsulant body and provides a point of external electrical contact for the first conductive terminal. An outer end of the second clip is exposed from the same or a different side face of the encapsulant body as the first clip and provides a point of external electrical contact for the second conductive terminal.