Conductive Column Lead Frame for IC Stacking Alignment
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Solution Overview
Problem
The electronic industry faces challenges in creating smaller, more functional, and cost-effective integrated circuit packages due to issues with reliability and yield in multi-chip and chip stack packages, particularly with the alignment and positioning of contacts in area array type packages.
Innovation Solution
The method involves fabricating a base package substrate, coupling a conductive column lead frame with an interconnect securing structure, forming a base package body, and removing the lead frame support to expose the interconnect securing structure, ensuring precise alignment and connection of conductive columns to component pads, thereby facilitating reliable stacking interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If area array type packages with surface-distributed terminals are used to increase terminal counts and reduce footprints, then package density and functionality are improved, but alignment precision and manufacturing complexity worsen
Solution Approach 1:
The patent introduces a lead frame structure with precisely positioned contact pads and a rigid support framework as an intermediary between the package substrate and the stacked device. This lead frame serves as a mechanical reference that ensures accurate alignment of multiple area array interfaces during stacking, solving the alignment precision problem while maintaining high terminal counts through the array configuration
Solution Approach 2:
The patent modifies the structural parameters of the package by introducing a rigid lead frame with precisely controlled geometry and contact pad positions. This changes the mechanical reference framework from the substrate alone to a composite structure with the lead frame, thereby improving alignment precision without reducing the terminal count capability of the area array configuration
2Adaptability or versatility
If multiple chips are combined in multi-chip or chip stack packages to increase memory density and multi-functionality, then package functionality is improved, but reliability and yield worsen
Solution Approach 1:
The patent divides the multi-functional package into separate stackable units, each containing a single chip that has already passed individual testing. This segmentation allows each unit to be independently validated before stacking, improving overall package yield and reliability while maintaining multi-functionality through the combination of different single-chip units in the stack
Solution Approach 2:
The patent performs complete testing and validation of each individual chip and single-chip package before the stacking process. This preliminary action ensures that only fully functional units are combined into multi-chip packages, thereby improving final package yield and reliability while achieving multi-functionality through the selective stacking of validated units
3Ease of manufacture
If lead frame type packages with edge-located terminals are used to simplify manufacturing, then ease of manufacture is improved, but package footprint and terminal count worsen
Solution Approach 1:
The patent merges the advantages of both lead frame type and area array type packages by using a lead frame structure that supports area array terminals. The lead frame provides the manufacturing simplicity and structural support, while the area array configuration of contacts on the lead frame enables higher terminal counts and smaller footprints, combining the benefits of both approaches
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate; coupling a conductive column lead frame to the base package substrate by: providing a lead frame support, patterning a conductive material on the lead frame support including forming an interconnect securing structure, and coupling the conductive material to the base package substrate; forming a base package body between the base package substrate and the conductive column lead frame; and removing the lead frame support from the conductive column lead frame for exposing the interconnect securing structure from the base package body.